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Numerical Simulation of the Cold Spray Deposition of Copper Particles on Polyether Ether Ketone (PEEK) Substrate

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Abstract

Cold spraying is receiving increasing attention as a method for metallizing polymer surfaces. Although metallic coatings on polymer surfaces have been successfully prepared in several studies, these are currently only in the experimental stages. In this study, the impact behaviour of copper particles deposited on polyether ether ketone (PEEK) substrates by cold spraying was investigated, and the deposition mechanism of the coatings was elucidated based on numerical simulations. Computational fluid dynamics simulations were used to determine the impact velocity of the particles, initial temperature of the particles, and surface temperature of the substrates. An Eulerian–Lagrange three-dimensional finite element model was developed to simulate the impact behaviour of single and multiple copper particles on the PEEK substrate. The numerical simulation results showed good agreement with the experimental data reported in the literature. This indicates that the thermal softening and melting of the material provide good conditions for mechanical interlocking of the particles with the substrate. Based on the results, the effects of particle velocity, particle temperature, and substrate temperature on the cold spray deposition behaviour of copper particles on PEEK substrates are discussed.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 51775427), all of the authors are grateful to the financial support.

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  1. Xi’an University of Science and Technology, No. 58 Yanta Middle Road, Xi’an City, 710054, Shaanxi, China

    Wei Tang, Jiayuan Zhang, Yan Li, Bo Yu & Jiabin Zhao

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  1. Wei Tang
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  2. Jiayuan Zhang
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  3. Yan Li
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Correspondence to Jiayuan Zhang.

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Tang, W., Zhang, J., Li, Y. et al. Numerical Simulation of the Cold Spray Deposition of Copper Particles on Polyether Ether Ketone (PEEK) Substrate. J Therm Spray Tech 30, 1792–1809 (2021). https://doi.org/10.1007/s11666-021-01254-3

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