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Erschienen in: Wireless Personal Communications 4/2017

24.08.2016

11–17 GHz Reconfigurable Stacked Power Amplifier Using Matched Slant Microstrip Line for Ku Band Application

verfasst von: Sandeep Kumar, Binod Kumar Kanaujia, Santanu Dwari, Ganga Prasad Pandey, Dinesh Kumar Singh

Erschienen in: Wireless Personal Communications | Ausgabe 4/2017

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Abstract

In this paper, a reconfigurable stacked CMOS power amplifier using matched microstrip slant line for Ku-band application is proposed. This work is mainly focused on a matching component which is microstrip line and it is slanted at 45°. This component is applied in stacked power amplifiers which provide a higher output power and enhanced power added efficiency (PAE), improved impedance matching and wide impedance bandwidth. Two, three and four stacked power amplifiers with matched microstrip slant lines are designed, analyzed and compared. First demonstration uses a single microstrip slant line that covers a frequency range of operation from 7 to 15.9 GHz with impedance bandwidth of 8.9 GHz. This impedance bandwidth can be enhanced using proposed two or more stacks of microstrip slant lines and exhibits greater than 20 GHz impedance bandwidth with reconfigure band of operation. Two, three and four stacked power amplifiers are designed and simulated in the advanced design system using 45 nm predictive technology model process. As per the results of PAs, effective four stacked power amplifier design achieves maximum PAE of 57 % while a saturated output power of 20 dBm. The forward gain of 17.5 dB is obtained within frequency range of 11–17 GHz.

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Literatur
1.
Zurück zum Zitat Rezaei, S., Belostotski, L., Ghannouchi, F., & Aflaki, P. (2013). Integrated design of a class-J power amplifier. IEEE Transactions on Microwave Theory and Techniques, 61, 1639–1647.CrossRef Rezaei, S., Belostotski, L., Ghannouchi, F., & Aflaki, P. (2013). Integrated design of a class-J power amplifier. IEEE Transactions on Microwave Theory and Techniques, 61, 1639–1647.CrossRef
2.
Zurück zum Zitat Grebennikov, A., & Wong, J. (2012). A dual-band parallel Doherty power amplifier for wireless applications. IEEE Transactions on Microwave Theory and Techniques, 60, 3214–3222.CrossRef Grebennikov, A., & Wong, J. (2012). A dual-band parallel Doherty power amplifier for wireless applications. IEEE Transactions on Microwave Theory and Techniques, 60, 3214–3222.CrossRef
3.
Zurück zum Zitat Dabag, H., Hanafi, B., Golcuk, F., Agah, A., Buckwalter, J., & Asbeck, P. (2013). Analysis and design of stacked-FET millimeter-wave poweramplifiers. IEEE Transactions on Microwave Theory and Techniques, 99, 1543–1556.CrossRef Dabag, H., Hanafi, B., Golcuk, F., Agah, A., Buckwalter, J., & Asbeck, P. (2013). Analysis and design of stacked-FET millimeter-wave poweramplifiers. IEEE Transactions on Microwave Theory and Techniques, 99, 1543–1556.CrossRef
4.
Zurück zum Zitat Rezaei, S., Belostotski, L., Ghannouchi, F. M., & Aflaki, P. (2013). Integrated design of a class-J power amplifier. IEEE Transactions on Microwave Theory and Techniques, 61, 1639–1647.CrossRef Rezaei, S., Belostotski, L., Ghannouchi, F. M., & Aflaki, P. (2013). Integrated design of a class-J power amplifier. IEEE Transactions on Microwave Theory and Techniques, 61, 1639–1647.CrossRef
5.
Zurück zum Zitat Shifrin, M., Ayasli, Y., & Katzin, P. (1992). A new power amplifier topology with series biasing and power combining of transistors. In IEEE microwave millimetre wave monolithic circuits Symposium (Vol. 41, pp. 39–41). Shifrin, M., Ayasli, Y., & Katzin, P. (1992). A new power amplifier topology with series biasing and power combining of transistors. In IEEE microwave millimetre wave monolithic circuits Symposium (Vol. 41, pp. 39–41).
6.
Zurück zum Zitat Sowlati, T., & Leenaerts, D. M. W. (2003). A 2.4 GHz 0.18 µm CMOS self-biased cascode power amplifier. IEEE Journal of Solid-State Circuits, 38, 1318–1324.CrossRef Sowlati, T., & Leenaerts, D. M. W. (2003). A 2.4 GHz 0.18 µm CMOS self-biased cascode power amplifier. IEEE Journal of Solid-State Circuits, 38, 1318–1324.CrossRef
7.
Zurück zum Zitat Ezzeddine, A. K. & Huang, H. C. (2003). The high voltage/high power FET (HiVP). In Proceedings of IEEE radio frequency integrated circuits symposium (Vol. 61, pp. 215–218). Ezzeddine, A. K. & Huang, H. C. (2003). The high voltage/high power FET (HiVP). In Proceedings of IEEE radio frequency integrated circuits symposium (Vol. 61, pp. 215–218).
8.
Zurück zum Zitat Pornpromlikit, S., Dabag, H. T., Hanafi, B., Kim, J., Larson, L. E., Buckwalter, J. F. et al. (2011). A-band amplifier implemented with stacked 45-nm CMOS FETs. In Proceedings of IEEE compound semiconductors integrated circuit symposium (Vol. 41, pp. 175–178). Pornpromlikit, S., Dabag, H. T., Hanafi, B., Kim, J., Larson, L. E., Buckwalter, J. F. et al. (2011). A-band amplifier implemented with stacked 45-nm CMOS FETs. In Proceedings of IEEE compound semiconductors integrated circuit symposium (Vol. 41, pp. 175–178).
9.
Zurück zum Zitat Fritsche, D., Wolf, R., & Ellinger, F. (2012). Analysis and design of a stacked power amplifier with very high bandwidth. IEEE Transactions on Microwave Theory and Techniques, 60, 3223–3231.CrossRef Fritsche, D., Wolf, R., & Ellinger, F. (2012). Analysis and design of a stacked power amplifier with very high bandwidth. IEEE Transactions on Microwave Theory and Techniques, 60, 3223–3231.CrossRef
10.
Zurück zum Zitat McRory, J. G., Rabjohn, G. G., & Johnston, R. H. (1999). Transformer coupled stacked FET power amplifiers. IEEE Journal of Solid-State Circuits, 34, 157–161.CrossRef McRory, J. G., Rabjohn, G. G., & Johnston, R. H. (1999). Transformer coupled stacked FET power amplifiers. IEEE Journal of Solid-State Circuits, 34, 157–161.CrossRef
11.
Zurück zum Zitat Lei, M. F., Tsai, Z. M., Lin, K. Y., & Wang, H. (2007). Design and analysis of stacked power amplifier in series-input and series-output configuration. IEEE Transactions on Microwave Theory and Techniques, 55, 2802–2812.CrossRef Lei, M. F., Tsai, Z. M., Lin, K. Y., & Wang, H. (2007). Design and analysis of stacked power amplifier in series-input and series-output configuration. IEEE Transactions on Microwave Theory and Techniques, 55, 2802–2812.CrossRef
12.
Zurück zum Zitat Gupta, K. C., Garg, R., Bahl, I., & Bhatia, P. (1996). Microstrip lines and slotlines (2nd ed.) Artech House Publishers, US Gupta, K. C., Garg, R., Bahl, I., & Bhatia, P. (1996). Microstrip lines and slotlines (2nd ed.)  Artech House Publishers, US
Metadaten
Titel
11–17 GHz Reconfigurable Stacked Power Amplifier Using Matched Slant Microstrip Line for Ku Band Application
verfasst von
Sandeep Kumar
Binod Kumar Kanaujia
Santanu Dwari
Ganga Prasad Pandey
Dinesh Kumar Singh
Publikationsdatum
24.08.2016
Verlag
Springer US
Erschienen in
Wireless Personal Communications / Ausgabe 4/2017
Print ISSN: 0929-6212
Elektronische ISSN: 1572-834X
DOI
https://doi.org/10.1007/s11277-016-3633-x

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