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Erschienen in:
Introduction to Multicore Systems On-Chip Kapitel lesen Erstes Kapitel lesen

2017 | OriginalPaper | Buchkapitel

6. 3D Integration Technology for Multicore Systems On-Chip

verfasst von : Abderazek Ben Abdallah

Erschienen in: Advanced Multicore Systems-On-Chip

Verlag: Springer Singapore

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Abstract

3D integration fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Three-dimensional NoCs/SoCs systems have been showing their advantages against conventional two-dimensional SoCs. Thanks to their reduced average interconnect length and lower interconnect-power consumption inherited from three-dimensional ICs. To ensure their correct functionality, such systems must be fault-tolerant to any short-term malfunction or permanent physical damage to ensure message delivery on time while minimizing the performance degradation as much as possible. This chapter introduces 3D integration technology for fault-tolerant multicore Systems On-Chip.

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Vorheriges Kapitel Advanced Multicore SoC Interconnects
Nächstes Kapitel Parallelizing Compiler for Single and Multicore Computing
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Metadaten
Titel
3D Integration Technology for Multicore Systems On-Chip
verfasst von
Abderazek Ben Abdallah
Copyright-Jahr
2017
Verlag
Springer Singapore
Buch
Advanced Multicore Systems-On-Chip

Print ISBN: 978-981-10-6091-5

Electronic ISBN: 978-981-10-6092-2

Copyright-Jahr: 2017

DOI
https://doi.org/10.1007/978-981-10-6092-2_6

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