Anzeige
Erschienen in:
26.05.2017
A novel method of synthesizing antioxidative copper nanoparticles for high performance conductive ink
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 18/2017
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Abstract
Due to low melting temperature, low price and high conductivity, copper nanoparticles have great potential to substitute conductive polymers, silver and gold nanoparticles and others in conductive inks. Here we developed a new, simple and green method to synthesize copper nanoparticles, which have the average size of around 140 nm and show remarkable ability to prevent oxidation. Using the copper nanoparticles for conductive ink, the electrical performance of copper film by depositing copper ink on polyimide was also investigated with the sintering temperature from 150 to 400 °C. The electrical resistivity is around 17.0 μΩ cm under sintering temperature of 250 °C, and can reach as low as 5.7 μΩ cm under the temperature of 400 °C. The proposed approach to synthesize copper nanoparticles for high performance conductive ink presents potential applications in flexible electronics.