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Erschienen in: Microsystem Technologies 6/2017

30.05.2016 | Technical Paper

A push-pull double-contact MEMS relay fabricated by MetalMUMPs process

verfasst von: Lifeng Wang, Yue Jin

Erschienen in: Microsystem Technologies | Ausgabe 6/2017

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Abstract

This document presents a push-pull double-contact MEMS (Micro ElectroMechanical System) relay. The MEMS relay is electrostatic driven and laterally actuating. Two push-pull structures form two parallel contacts for the proposed MEMS relay, which can make the contact resistance of the MEMS relay be smaller. The push and pull actions of the push-pull actuators can be accomplished simultaneously using only one action signal. In addition, high inductance DC bias line and substrate removal are used for additional electrical and/or thermal isolation. The fabrication of the proposed switch is based on the standard MetalMUMPs process. The measured pull-in voltage is 116 V and the switch-ON delay is 44 μs. Contact resistance of the MEMS relay is less than 1 Ω when the stress voltage exceeds 120 V.

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Metadaten
Titel
A push-pull double-contact MEMS relay fabricated by MetalMUMPs process
verfasst von
Lifeng Wang
Yue Jin
Publikationsdatum
30.05.2016
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 6/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-016-3001-5

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