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2016 | OriginalPaper | Buchkapitel

A Route Optimization Problem in Electrical PCB Inspections: Pickup and Delivery TSP-Based Formulation

verfasst von : Hideki Katagiri, Qingqiang Guo, Hongwei Wu, Hiroshi Hamori, Kosuke Kato

Erschienen in: Transactions on Engineering Technologies

Verlag: Springer Singapore

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Abstract

This paper discusses a new route optimization for inspecting printed circuit boards (PCBs). In inspections of PCBs, a number of PCBs arrayed on a plane are tested by a probe in some order or sequence. Since the length of an inspection route depends on the order or sequence that the probe visits and tests each of PCBs, the finding of best visiting order or sequence is quite important in order to reduce the PCB inspection time. Recently, due to the miniaturization of PCBs, the procedure of “alignment” has become necessary before the electrical test, which means that there is a precedence constraint between alignment and test. This paper models a PCB inspection route optimization problem with alignment operations as a class of pickup and delivery traveling salesman problem (PDTSP) which is a mixed 0–1 integer programming problem. An efficient heuristic algorithm is proposed to solve the problem with a practical computational time. The proposed algorithm is installed into real PCB inspection machines that have been widely used in the world. Cost reduction effects for PCB inspection factories are discussed.

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Metadaten
Titel
A Route Optimization Problem in Electrical PCB Inspections: Pickup and Delivery TSP-Based Formulation
verfasst von
Hideki Katagiri
Qingqiang Guo
Hongwei Wu
Hiroshi Hamori
Kosuke Kato
Copyright-Jahr
2016
Verlag
Springer Singapore
DOI
https://doi.org/10.1007/978-981-10-0551-0_15

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