AC Coupled Wireless Power Delivery

The three-dimensional (3D) integration of stacked chips has recently gathered popularity as an approach for implementing a System-in-a-Package (SiP). Throughsilicon vias (TSVs) and bonding wires are the primary candidates for electrically connecting the stacked chips. Current commercially available 3D stacked chips use bonding wires due to their low cost. Bonding wires, however, are not a final solution for 3D stacked chips, because they limit signal bandwidth and hence the number of the stacked chips. TSVs represent an ideal technology for 3D stacked chips, because their signal bandwidth is high and the number of the stacked chips is theoretically unlimited. TSVs, however, have not been put to practical use in 3D stacked chips due to their high cost.