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Erschienen in:
2001 | OriginalPaper | Buchkapitel
Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation
verfasst von : A. Hössinger, T. Binder, W. Pyka, S. Selberherr
Erschienen in: Simulation of Semiconductor Processes and Devices 2001
Verlag: Springer Vienna
Enthalten in: Professional Book Archive
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For the simulation of etching and deposition processes the cellular method is very popular, because of its high robustness compared to alternative methods like the level set or the moving boundary approach. We present a method for the simulation of topography processes based on the cellular method that overcomes the problem of loss of information when using a cellular based simulator in combination with simulators using polygonal data representations. Additionally the new method allows to increase the resolution of the topography simulator without a significantly higher memory requirement.