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Journal of Material Cycles and Waste Management

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Open Access 03.11.2020 | ORIGINAL ARTICLE

An automated assessment method for integrated circuit chip detachment from printed circuit board by multistep binarization and template matching of X-ray transmission images

verfasst von: Takao Ueda, Tatsuya Oki, Shigeki Koyanaka

Erschienen in: Journal of Material Cycles and Waste Management | Ausgabe 1/2021

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Abstract

Given the increase in digital product waste, demand for recycling of printed circuit boards (PCBs) is increasing. Precious and minor metals are often well concentrated in integrated circuit (IC) chips, especially in PCBs; hence, IC chips are primary targets for recycling. The technology for the non-destructive detachment of IC chips from PCBs is increasing in sophistication; however, the effectiveness of IC chip detachment is currently assessed manually and visually. In the present study, an automated IC chip detachment assessment method was developed, which combines multistep binarization and template matching of X-ray transmission images of crushed PCBs. To validate the method, five types of mechanically crushed PCBs from mobile phones were examined, and the developed method successfully assessed the IC chip detachment rate, with an average error rate of only 2.2% compared to visual assessment.

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Titel: An automated assessment method for integrated circuit chip detachment from printed circuit board by multistep binarization and template matching of X-ray transmission images
verfasst von: Takao Ueda
Tatsuya Oki
Shigeki Koyanaka
Publikationsdatum: 03.11.2020
Verlag: Springer Japan
Erschienen in: Journal of Material Cycles and Waste Management / Ausgabe 1/2021
Print ISSN: 1438-4957
Elektronische ISSN: 1611-8227
DOI: https://doi.org/10.1007/s10163-020-01131-1

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Correction to: An automated assessment method for integrated circuit chip detachment from printed circuit board by multistep binarization and template matching of X-ray transmission images