Skip to main content
Erschienen in: Journal of Electronic Testing 3/2021

18.08.2021

Analysis and Detection of Open-gate Defects in Redundant Structures of a FinFET SRAM Cell

verfasst von: Victor Champac, Javier Mesalles, Hector Villacorta, Fabian Vargas

Erschienen in: Journal of Electronic Testing | Ausgabe 3/2021

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

FinFET technology is used in leading high-performance/power-efficient electronic products. This technology has proven its efficiency after 22nm technology nodes. However, FinFET technology has new manufacturing and design complexities. Thus, it is required to study the behavior of defects in FinFET-based SRAM memories and develop new test strategies for those not covered by conventional test strategies based on CMOS fault modeling. This paper study open-gate defects affecting only one of the parallel fins in the driver transistors of the memory cell. These opens do not cause a functional fault but reduce the Static Noise Margin (SNM) of the memory cells. Moreover, they may fail under certain operating conditions and may constitute a long-term reliability issue. The behavior of these defects is studied for the hold, read and write operations using realistic defect models. By using a short write time test, the detection of these defects is investigated. The effectiveness of the short write time test method at nominal parameters and under process variations is evaluated. The detection probability of these defects can be further enhanced using a higher power supply voltage.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Weitere Produktempfehlungen anzeigen
Fußnoten
1
Minimum write time is defined as the minimum required time to write both logic states correctly at the memory cell.
 
Literatur
2.
Zurück zum Zitat Bhoj AN, Simsir MO, Jha NK (2012) Fault models for logic circuits in the multigate era. IEEE Trans Nanotechnol 11(1):182–193CrossRef Bhoj AN, Simsir MO, Jha NK (2012) Fault models for logic circuits in the multigate era. IEEE Trans Nanotechnol 11(1):182–193CrossRef
3.
Zurück zum Zitat Chen MC, Wu TH, Wu CW (2018) A built-in self-test scheme for detecting defects in finfet-based sram circuit, in IEEE 27th Asian Test Symposium. IEEE, pp. 19–24 Chen MC, Wu TH, Wu CW (2018) A built-in self-test scheme for detecting defects in finfet-based sram circuit, in IEEE 27th Asian Test Symposium. IEEE, pp. 19–24
4.
Zurück zum Zitat Dunga MV, Lin CH, Xi X, Lu DD, Niknejad AM, Hu C (2006) Modeling advanced fet technology in a compact model. IEEE Trans Electron Devices 53(9):1971–1978CrossRef Dunga MV, Lin CH, Xi X, Lu DD, Niknejad AM, Hu C (2006) Modeling advanced fet technology in a compact model. IEEE Trans Electron Devices 53(9):1971–1978CrossRef
5.
Zurück zum Zitat Forero F, Villacorta H, Renovell M, Champac V (2019) Modeling and detectability of full open gate defects in finfet technology, IEEE Transactions on Very Large Scale Integration (VLSI) Systems 127(9)2180–2190 Forero F, Villacorta H, Renovell M, Champac V (2019) Modeling and detectability of full open gate defects in finfet technology, IEEE Transactions on Very Large Scale Integration (VLSI) Systems 127(9)2180–2190
6.
Zurück zum Zitat Guo D, et al (2014) 10nm finfet technology for low power and high performance applications, in 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT). IEEE Guo D, et al (2014) 10nm finfet technology for low power and high performance applications, in 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT). IEEE
7.
Zurück zum Zitat Hamdioui S, Taouil M, Haron NZ (2015) Testing open defects in memristor-based memories. IEEE Trans Comput 64(1):247–259MathSciNetCrossRef Hamdioui S, Taouil M, Haron NZ (2015) Testing open defects in memristor-based memories. IEEE Trans Comput 64(1):247–259MathSciNetCrossRef
8.
Zurück zum Zitat Harutyunyan G, Tshagharyan G, Vardanian V, Zorian Y (2014) IEEE 32nd VLSI Test Symposium (VTS). IEEE 2014:1–6 Harutyunyan G, Tshagharyan G, Vardanian V, Zorian Y (2014) IEEE 32nd VLSI Test Symposium (VTS). IEEE 2014:1–6
9.
Zurück zum Zitat Harutyunyan G, Tshagharyan G, Zorian Y (2015) Impact of parameter variations on finfet faults, in IEEE 33rd VLSI Test Symposium (VTS). IEEE Harutyunyan G, Tshagharyan G, Zorian Y (2015) Impact of parameter variations on finfet faults, in IEEE 33rd VLSI Test Symposium (VTS). IEEE
10.
Zurück zum Zitat Harutyunyan G, Tshagharyan G, Zorian Y (2015) Test and repair methodology for finfet-based memories. IEEE Trans Device Mater Reliab 15(1):3–9CrossRef Harutyunyan G, Tshagharyan G, Zorian Y (2015) Test and repair methodology for finfet-based memories. IEEE Trans Device Mater Reliab 15(1):3–9CrossRef
11.
Zurück zum Zitat Ichihashi M, Woo Y, Parihar S (2016) International Symposium on VLSI Technology, Systems and Application (VLSI-TSA). IEEE 2016:1–2 Ichihashi M, Woo Y, Parihar S (2016) International Symposium on VLSI Technology, Systems and Application (VLSI-TSA). IEEE 2016:1–2
12.
Zurück zum Zitat Kleeberger VB, Graeb H, Schlichtmann U (2013) Predicting future product performance: modeling and evaluation of standard cells in finfet technologies, in Proceedings of the 50th Annual Design Automation Conference. ACM, p. 33 Kleeberger VB, Graeb H, Schlichtmann U (2013) Predicting future product performance: modeling and evaluation of standard cells in finfet technologies, in Proceedings of the 50th Annual Design Automation Conference. ACM, p. 33
13.
Zurück zum Zitat Lin Y, Yu B, Xu B, Pan DZ (2017) Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. IEEE Trans Comput Aided Des Integr Circuits Syst 36(7):1140–1152CrossRef Lin Y, Yu B, Xu B, Pan DZ (2017) Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. IEEE Trans Comput Aided Des Integr Circuits Syst 36(7):1140–1152CrossRef
14.
Zurück zum Zitat Liu Y, Xu Q (2012) IEEE International Test Conference. IEEE 2012:1–9 Liu Y, Xu Q (2012) IEEE International Test Conference. IEEE 2012:1–9
15.
Zurück zum Zitat Lu DD, Lin CH, Niknejad AM, Hu C (2010) Compact modeling of variation in finfet sram cells. IEEE Design Test Comp 2(27):44–50CrossRef Lu DD, Lin CH, Niknejad AM, Hu C (2010) Compact modeling of variation in finfet sram cells. IEEE Design Test Comp 2(27):44–50CrossRef
16.
Zurück zum Zitat Medeiros G, Taouil M, Fieback M, Poehls L, Hamdioui S (2019) Dft scheme for hard-to-detect faults in finfet srams, in European Test Symposium. IEEE Medeiros G, Taouil M, Fieback M, Poehls L, Hamdioui S (2019) Dft scheme for hard-to-detect faults in finfet srams, in European Test Symposium. IEEE
18.
Zurück zum Zitat Moreno J, Renovell M, Champac V (2016) Effectiveness of low-voltage testing to detect interconnect open defects under process variations, IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24(1):378-382 Moreno J, Renovell M, Champac V (2016) Effectiveness of low-voltage testing to detect interconnect open defects under process variations, IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24(1):378-382
19.
Zurück zum Zitat Natarajan S, et al (2014) A 14nm logic technology featuring 2nd-generation finfet, air-gapped interconnects, self-aligned double patterning and a 0.0588 \(\mu m^2\) sram cell size, in IEEE International Electron Devices Meeting (IEDM). IEEE Natarajan S, et al (2014) A 14nm logic technology featuring 2nd-generation finfet, air-gapped interconnects, self-aligned double patterning and a 0.0588 \(\mu m^2\) sram cell size, in IEEE International Electron Devices Meeting (IEDM). IEEE
20.
Zurück zum Zitat Papoulis A, Pillai SU (2002) Probability, random variables, and stochastic processes. Tata McGraw-Hill Education Papoulis A, Pillai SU (2002) Probability, random variables, and stochastic processes. Tata McGraw-Hill Education
21.
Zurück zum Zitat Patel K, Liu TJK, Spanos CJ (2009) Gate line edge roughness model for estimation of finfet performance variability. IEEE Trans Electron Devices 56(12):3055–3063CrossRef Patel K, Liu TJK, Spanos CJ (2009) Gate line edge roughness model for estimation of finfet performance variability. IEEE Trans Electron Devices 56(12):3055–3063CrossRef
23.
Zurück zum Zitat Pavlov A, Sachdev M, Jose PDG (2004) An sram weak cell fault model and dft technique with a programmable detection threshold, in2004IEEE International Test Conference. IEEE 2004:1006–1015 Pavlov A, Sachdev M, Jose PDG (2004) An sram weak cell fault model and dft technique with a programmable detection threshold, in2004IEEE International Test Conference. IEEE 2004:1006–1015
24.
Zurück zum Zitat Wang X, Cheng B, Brown AR, Millar C, Asenov A (2012) Statistical variability in 14-nm node SOI finFETs and its impact on corresponding 6T-SRAM cell design. In Proceedings of the European Solid-State Device Research Conference (ESSDERC). IEEE, 2012, pp. 113–116 Wang X, Cheng B, Brown AR, Millar C, Asenov A (2012) Statistical variability in 14-nm node SOI finFETs and its impact on corresponding 6T-SRAM cell design. In Proceedings of the European Solid-State Device Research Conference (ESSDERC). IEEE, 2012, pp. 113–116
25.
Zurück zum Zitat Weste NH, Harris DM (2011) Cmos Vlsi Design: A Circuits And Systems Perspective, 4/E. Pearson Education Inc Weste NH, Harris DM (2011) Cmos Vlsi Design: A Circuits And Systems Perspective, 4/E. Pearson Education Inc
Metadaten
Titel
Analysis and Detection of Open-gate Defects in Redundant Structures of a FinFET SRAM Cell
verfasst von
Victor Champac
Javier Mesalles
Hector Villacorta
Fabian Vargas
Publikationsdatum
18.08.2021
Verlag
Springer US
Erschienen in
Journal of Electronic Testing / Ausgabe 3/2021
Print ISSN: 0923-8174
Elektronische ISSN: 1573-0727
DOI
https://doi.org/10.1007/s10836-021-05955-z

Weitere Artikel der Ausgabe 3/2021

Journal of Electronic Testing 3/2021 Zur Ausgabe

EditorialNotes

Editorial

Neuer Inhalt