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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 13/2018

26.04.2018

Analysis of continuous recrystallization (sub)grain rotation behavior in Pb-free solder bumps under a 0.1 µm/s shear rate

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 13/2018

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Abstract

Localized recrystallization occurs in Pb-free solder joints under thermomechanical fatigue stress (thermal fatigue). Scanning electronic microscopy and electron backscattered diffraction were used to obtain the microstructures and grain orientations, respectively, of Sn3.5Ag solder bumps after shear testing. At room temperature, recovery and continuous recrystallization tend to occur at the near-pad interface and near-shear edge regions of the solder bumps under shear stress. A (sub)grain rotation mechanism dominates the recrystallized (sub)grains, distinguishing them from the initial orientations. Additionally, the rotation axis and angle were investigated to further elucidate the recrystallized (sub)grain rotation behavior of Pb-free solder bumps. The results show the formation of a single rotation axis between a (sub)grain and its neighboring (sub)grain during recrystallization, indicating a relationship between continuous recrystallization and the Sn slip systems in Pb-free solder alloys.
Vorheriger Artikel Sol–gel synthesis and photocatalytic activity of ZnO–Ag–Sm nanoparticles for water treatment
Nächster Artikel The effects of doping type on structural and electrical properties of silicon nanocrystals layers grown by plasma enhanced chemical vapor deposition

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Metadaten
Titel
Analysis of continuous recrystallization (sub)grain rotation behavior in Pb-free solder bumps under a 0.1 µm/s shear rate
Publikationsdatum
26.04.2018
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 13/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9181-2

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