3D molecular interconnection technology

For the functional modeling of complex biological processing structures with high-density 3D connections (such as the visual cortex), we propose a simple multi-chip stack structure, with through-chip connections and molecular wires between the layers. We have designed and fabricated a two-chip stack, and molecular wiring materials have been examined: chemically and electrochemically grown conductive polymers. The next experimental stage will be to fabricate a three-chip stack. We have calculated the rate at which electrical signals can be transmitted through the layer and down a molecular wire. The measured values of conductivity for the polymer-based wires lie in the range σ = 1 − 100 S m⁻¹, which would allow bandwidths up to 100 Mbits s⁻¹ per connection.