Abstract
Removal technique of metal materials from a metal plating insulator substrate using a pulsed arc discharge was proposed and its fundamental characteristics were investigated. The metal plating substrate with three metal-layers structure (cupper, nickel and gold layers) is used as the sample substrate. Repetitive pulsed arc discharge plasma is generated using three types of electrode systems. Effects of the electrode systems on the metal plating removal from the insulator substrate were investigated. The metal plating was removed by the pulsed arc discharge between the electrode and substrate surface. A part of the gold layer, which is the topmost metal layer on the insulator substrate is vaporized and removed by the repetitive pulsed arc discharges.
Export citation and abstract BibTeX RIS
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.