Chip Scale Package Technology

In the last three decades, many innovative microelectronics packaging and interconnection-related technologies, such as tape automated bonding (TAB), flip chip, multi-chip modules (MCMs), and ball grid arrays (BGAs), have been developed, applied, and demonstrated in a variety of electronic products. The demand for high-density, high-performance, high-function, portable consumer electronics continues almost undiminished. The ever-increasing demand for product performance, versatility, and miniaturization, resulted in significant advances in semiconductor device power, performance and pin count. These, in turn, have imposed significant challenges upon electronic companies to provide even more compact, cost-effective, and reliable products [1,2].