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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 15/2018

19.06.2018

Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

verfasst von: Norliza Ismail, Roslina Ismail, Azman Jalar, Ghazali Omar, Emee Marina Salleh, Norinsan Kamil, Irman Abdul Rahman

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 15/2018

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Abstract

The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.
Vorheriger Artikel Solution volume effect on structural, optical and photovoltaic properties of nebulizer spray deposited SnS thin films
Nächster Artikel Structure, photoluminescence, and magnetic properties of Co-doped ZnO nanoparticles

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Metadaten
Titel
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
verfasst von
Norliza Ismail
Roslina Ismail
Azman Jalar
Ghazali Omar
Emee Marina Salleh
Norinsan Kamil
Irman Abdul Rahman
Publikationsdatum
19.06.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 15/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9410-8

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