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Erschienen in:

2011 | OriginalPaper | Buchkapitel

13. Composition of Adhesives

verfasst von : Hyun-Joong Kim, Dong-Hyuk Lim, Hyeon-Deuk Hwang, Byoung-Ho Lee

Erschienen in: Handbook of Adhesion Technology

Verlag: Springer Berlin Heidelberg

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Abstract

Adhesives and sealants are generally developed and prepared for many applications such as packaging, construction, automobile, electronic, etc. An adhesive formulation will depend on the base materials and requirements of a particular application. Development managers or formulators have to have a public knowledge about the chemical composition and role of many components for reducing trials and errors. This chapter focuses on the definition and function of adhesive composition such as primary resins, solvents, fillers, plasticizers, reinforcements, and various additives.

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Titel: Composition of Adhesives
verfasst von: Hyun-Joong Kim
Dong-Hyuk Lim
Hyeon-Deuk Hwang
Byoung-Ho Lee
Verlag: Springer Berlin Heidelberg
Buch: Handbook of Adhesion Technology
Print ISBN: 978-3-642-01168-9

Electronic ISBN: 978-3-642-01169-6

Copyright-Jahr: 2011
DOI: https://doi.org/10.1007/978-3-642-01169-6_13

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