Copper–SiC whiskers composites with interface optimized by Ti₃SiC₂

In the present work, we propose Ti₃SiC₂ as the interlayer material to improve the interfacial bonding properties of SiC whiskers-reinforced copper matrix composites. For the first time, Ti₃SiC₂ coating was in situ fabricated on the surface of SiC whiskers in a molten salt bath. Ti₃SiC₂-coated SiC whiskers- and bare SiC whiskers-reinforced copper matrix composites were fabricated by spark plasma sintering. The influence of the Ti₃SiC₂ interlayer on the interfacial properties, mechanical properties, and thermal conductivity of the composites was investigated. The results show that the Ti₃SiC₂ interlayer can largely improve the interfacial bonding properties of the composites. Therefore, the composites reinforced with Ti₃SiC₂-coated SiC whiskers exhibit much higher tensile strength than the composites reinforced with bare SiC whiskers. The results also show that the Ti₃SiC₂ interlayer could decrease the thermal conductivity of the composites in certain extent.