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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 12/2020

13.05.2020 | Review

Corrosion behavior of Sn-based lead-free solder alloys: a review

verfasst von: Shuai Li, Xingxing Wang, Zhongying Liu, Yongtao Jiu, Shuye Zhang, Jinfeng Geng, Xiaoming Chen, Shengjin Wu, Peng He, Weimin Long

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 12/2020

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Abstract

Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn–Bi, Sn–Cu, Sn–Zn, Sn–Ag, Sn–Ag–Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.
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Metadaten
Titel
Corrosion behavior of Sn-based lead-free solder alloys: a review
verfasst von
Shuai Li
Xingxing Wang
Zhongying Liu
Yongtao Jiu
Shuye Zhang
Jinfeng Geng
Xiaoming Chen
Shengjin Wu
Peng He
Weimin Long
Publikationsdatum
13.05.2020
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 12/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03540-2

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