10.09.2018 | TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder | Ausgabe 1/2019

Corrosion-Induced Mass Loss of Cu9Al4 at the Cu-Al Ball–Bond Interface: Explained Based on Full Immersion of Cu, Al, and Cu-Al Intermetallic Galvanic Couples
- Zeitschrift:
- Journal of Electronic Materials > Ausgabe 1/2019