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Erschienen in: Journal of Materials Science 4/2014

01.02.2014

Current conduction mechanisms in HfO2 and SrHfON thin films prepared by magnetron sputtering

verfasst von: Li-ping Feng, Ning Li, Hao Tian, Zheng-tang Liu

Erschienen in: Journal of Materials Science | Ausgabe 4/2014

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Abstract

Metal–oxide–semiconductor (MOS) capacitors incorporating HfO2 and SrHfON gate dielectrics were fabricated by magnetron sputtering. The interface quality, thermal stability, and electrical properties of the MOS capacitors have been investigated. Compared to HfO2 dielectric film, SrHfON dielectric film has thin interface layer with Si substrate, good thermal stability, and low leakage current densities. The dominant current conduction mechanisms (CCMs) of HfO2 film are Schottky emission or Poole–Frenkel emission at low and high electric fields. The main CCMs of SrHfON film are Schottky emission or Poole–Frenkel emission at low electric field, whereas, the CCMs are replaced by space charge limited current at high electric field.

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Literatur
1.
Zurück zum Zitat He G, Zhu L, Sun Z, Wan Q, Zhang L (2011) Integrations and challenges of novel high-k gate stacks in advanced CMOS technology. Prog Mater Sci 56:475–572CrossRef He G, Zhu L, Sun Z, Wan Q, Zhang L (2011) Integrations and challenges of novel high-k gate stacks in advanced CMOS technology. Prog Mater Sci 56:475–572CrossRef
2.
Zurück zum Zitat Sudheendran K, James Raju KC (2011) Electrical properties of pulsed laser deposited Bi2Zn2/3Nb4/3O7 thin films for high K gate dielectric application. J Mater Sci Mater Electron 22:626–630 Sudheendran K, James Raju KC (2011) Electrical properties of pulsed laser deposited Bi2Zn2/3Nb4/3O7 thin films for high K gate dielectric application. J Mater Sci Mater Electron 22:626–630
3.
Zurück zum Zitat He G, Chen X, Sun Z (2013) Interface engineering and chemistry of Hf-based high-k dielectrics on III–V substrates. Surf Sci Rep 68:68–107CrossRefADS He G, Chen X, Sun Z (2013) Interface engineering and chemistry of Hf-based high-k dielectrics on III–V substrates. Surf Sci Rep 68:68–107CrossRefADS
4.
Zurück zum Zitat Neumayer DA, Cartier E (2001) Materials characterization of ZrO2–SiO2 and HfO2–SiO2 binary oxides deposited by chemical solution deposition. J Appl Phys 90:1801–1808CrossRefADS Neumayer DA, Cartier E (2001) Materials characterization of ZrO2–SiO2 and HfO2–SiO2 binary oxides deposited by chemical solution deposition. J Appl Phys 90:1801–1808CrossRefADS
5.
Zurück zum Zitat Akbar MS, Cho HJ, Choi R, Kang CS, Kang CY, Choi CH, Rhee SJ, Kim YH, Lee JC (2004) Optimized NH3 annealing process for high-quality HfSiON gate oxide. IEEE Electron Device Lett 25:465–467CrossRefADS Akbar MS, Cho HJ, Choi R, Kang CS, Kang CY, Choi CH, Rhee SJ, Kim YH, Lee JC (2004) Optimized NH3 annealing process for high-quality HfSiON gate oxide. IEEE Electron Device Lett 25:465–467CrossRefADS
6.
Zurück zum Zitat Liu YX, Shim SI, Wang XW, Lee LS, Tsai MJ, Ma TP (2008) High-quality high-k HfON formed with plasma jet assisted PVD process and application as tunnel dielectric for flash memories. Microelectron Eng 85:45–48CrossRef Liu YX, Shim SI, Wang XW, Lee LS, Tsai MJ, Ma TP (2008) High-quality high-k HfON formed with plasma jet assisted PVD process and application as tunnel dielectric for flash memories. Microelectron Eng 85:45–48CrossRef
7.
Zurück zum Zitat Zhu WJ, Tamagawa T, Gibson M, Furukawa T, Ma TP (2002) Effect of Al Inclusion in HfO2 on the physical and electrical properties of the dielectrics. IEEE Electron Device Lett 23:649–651CrossRefADS Zhu WJ, Tamagawa T, Gibson M, Furukawa T, Ma TP (2002) Effect of Al Inclusion in HfO2 on the physical and electrical properties of the dielectrics. IEEE Electron Device Lett 23:649–651CrossRefADS
8.
Zurück zum Zitat Sen B, Yang BL, Wong H, Kok CW, Chu PK, Huang A (2008) Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation. Microelectron Reliab 48:1765–1768CrossRef Sen B, Yang BL, Wong H, Kok CW, Chu PK, Huang A (2008) Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation. Microelectron Reliab 48:1765–1768CrossRef
9.
Zurück zum Zitat Cheng XH, Song ZR, Jiang J, Yu YH, Yang WW, Shen DS (2006) Study of HfSiO film prepared by electron beam evaporation for high-k gate dielectric applications. Appl Surf Sci 252:8073–8076CrossRefADS Cheng XH, Song ZR, Jiang J, Yu YH, Yang WW, Shen DS (2006) Study of HfSiO film prepared by electron beam evaporation for high-k gate dielectric applications. Appl Surf Sci 252:8073–8076CrossRefADS
10.
Zurück zum Zitat Kim J, Yong K (2007) MOCVD and characterization of Hf-silicate thin films using HTB and TEMAS. J Non-Cryst Solids 353:1172–1176CrossRefADS Kim J, Yong K (2007) MOCVD and characterization of Hf-silicate thin films using HTB and TEMAS. J Non-Cryst Solids 353:1172–1176CrossRefADS
11.
Zurück zum Zitat Liu CH, Juan PC, Lin JY (2010) The influence of lanthanum doping position in ultra-thin HfO2 films for high-k gate dielectrics. Thin Solid Films 518:7455–7459CrossRefADS Liu CH, Juan PC, Lin JY (2010) The influence of lanthanum doping position in ultra-thin HfO2 films for high-k gate dielectrics. Thin Solid Films 518:7455–7459CrossRefADS
12.
Zurück zum Zitat Yu Q, Xu G, Wang W, Chen D, Shi S, Han Z, Ye T (2008) Study on characteristics of thermally stable HfLaON gate dielectric with TaN metal gate. Appl Phys Lett 93:252903CrossRefADS Yu Q, Xu G, Wang W, Chen D, Shi S, Han Z, Ye T (2008) Study on characteristics of thermally stable HfLaON gate dielectric with TaN metal gate. Appl Phys Lett 93:252903CrossRefADS
13.
Zurück zum Zitat Feng LP, Liu ZT (2009) Structural and electrical properties of thin SrHfON films for high-k gate dielectric. Appl Phys Lett 94:252907CrossRefADS Feng LP, Liu ZT (2009) Structural and electrical properties of thin SrHfON films for high-k gate dielectric. Appl Phys Lett 94:252907CrossRefADS
14.
Zurück zum Zitat Feng LP, Wang YQ, Tian H, Liu ZT (2012) Effect of annealing on composition, structure and optical properties of SrHfON thin films. Appl Surf Sci 258:9706–9710CrossRefADS Feng LP, Wang YQ, Tian H, Liu ZT (2012) Effect of annealing on composition, structure and optical properties of SrHfON thin films. Appl Surf Sci 258:9706–9710CrossRefADS
15.
Zurück zum Zitat Feng LP, Liu ZT, Tian H, Liu L (2012) Influence of RF power on structure and electrical properties of sputtered SrHfON thin films. Mater Lett 78:66–68CrossRef Feng LP, Liu ZT, Tian H, Liu L (2012) Influence of RF power on structure and electrical properties of sputtered SrHfON thin films. Mater Lett 78:66–68CrossRef
16.
Zurück zum Zitat Feng LP, Liu ZT, Shen YM (2009) Compositional, structural and electronic characteristics of HfO2 and HfSiO dielectrics prepared by radio frequency magnetron sputtering. Vacuum 83:902–905CrossRef Feng LP, Liu ZT, Shen YM (2009) Compositional, structural and electronic characteristics of HfO2 and HfSiO dielectrics prepared by radio frequency magnetron sputtering. Vacuum 83:902–905CrossRef
17.
Zurück zum Zitat Mallouky A, Bernede JC (1988) Characterization of MoSe2 thin films. Thin Solid Films 158:285–298CrossRefADS Mallouky A, Bernede JC (1988) Characterization of MoSe2 thin films. Thin Solid Films 158:285–298CrossRefADS
18.
Zurück zum Zitat Lupina G, Kozłowski G, Dabrowski J, Dudek P, Lippert G, Müssig HJ (2008) Dielectric and structural properties of thin SrHfO3 layers on TiN. Appl Phys Lett 93:252907CrossRefADS Lupina G, Kozłowski G, Dabrowski J, Dudek P, Lippert G, Müssig HJ (2008) Dielectric and structural properties of thin SrHfO3 layers on TiN. Appl Phys Lett 93:252907CrossRefADS
19.
Zurück zum Zitat Cho DY, Oh SJ, Chang YJ, Noh TW, Jung R, Lee JC (2006) Role of oxygen vacancy in HfO2/SiO2/Si(100) interfaces. Appl Phys Lett 88:193502CrossRefADS Cho DY, Oh SJ, Chang YJ, Noh TW, Jung R, Lee JC (2006) Role of oxygen vacancy in HfO2/SiO2/Si(100) interfaces. Appl Phys Lett 88:193502CrossRefADS
20.
Zurück zum Zitat He G, Liu M, Zhu LQ, Chang M, Fang Q, Zhanget LD (2005) Effect of postdeposition annealing on the thermal stability and structural characteristics of sputtered HfO2 films on Si (1 0 0). Surf Sci 576:67–75CrossRefADS He G, Liu M, Zhu LQ, Chang M, Fang Q, Zhanget LD (2005) Effect of postdeposition annealing on the thermal stability and structural characteristics of sputtered HfO2 films on Si (1 0 0). Surf Sci 576:67–75CrossRefADS
21.
Zurück zum Zitat Chou YH, Chiu HT, Kuo TF, Chi CC, Chuang SH (2006) Intriguing conducting properties of HfO x N y thin films prepared from the Hf[N(C2H5)2]4. Appl Phys Lett 89:252901CrossRefADS Chou YH, Chiu HT, Kuo TF, Chi CC, Chuang SH (2006) Intriguing conducting properties of HfO x N y thin films prepared from the Hf[N(C2H5)2]4. Appl Phys Lett 89:252901CrossRefADS
22.
Zurück zum Zitat Yu T, Jin C, Yang X, Dong Y, Zhang H, Zhuge L, Wu X, Wu Z (2012) The structure and electrical properties of HfTaON high-k films prepared by DIBSD. Appl Surf Sci 258:2953–2958CrossRefADS Yu T, Jin C, Yang X, Dong Y, Zhang H, Zhuge L, Wu X, Wu Z (2012) The structure and electrical properties of HfTaON high-k films prepared by DIBSD. Appl Surf Sci 258:2953–2958CrossRefADS
23.
Zurück zum Zitat Pant G, Gnade A, Kim MJ, Wallace RM, Gnade BE (2006) Comparison of electrical and chemical characteristics of ultrathin HfON versus HfSiON dielectrics. Appl Phys Lett 89:032904CrossRefADS Pant G, Gnade A, Kim MJ, Wallace RM, Gnade BE (2006) Comparison of electrical and chemical characteristics of ultrathin HfON versus HfSiON dielectrics. Appl Phys Lett 89:032904CrossRefADS
24.
Zurück zum Zitat Kirsch PD, Kang CS, Lozano J, Lee JC, Ekerdt JG (2002) Electrical and spectroscopic comparison of HfO2/Si interfaces on nitrided and un-nitrided Si(100). J Appl Phys 91:4353–4363CrossRefADS Kirsch PD, Kang CS, Lozano J, Lee JC, Ekerdt JG (2002) Electrical and spectroscopic comparison of HfO2/Si interfaces on nitrided and un-nitrided Si(100). J Appl Phys 91:4353–4363CrossRefADS
25.
Zurück zum Zitat Kang CS, Cho HJ, Onishi K, Nieh R, Choi R, Gopalan S, Krishnan S, Han JH, Lee JC (2002) Bonding states and electrical properties of ultrathin HfO x N y gate dielectrics. Appl Phys Lett 81:2593–2595CrossRefADS Kang CS, Cho HJ, Onishi K, Nieh R, Choi R, Gopalan S, Krishnan S, Han JH, Lee JC (2002) Bonding states and electrical properties of ultrathin HfO x N y gate dielectrics. Appl Phys Lett 81:2593–2595CrossRefADS
26.
Zurück zum Zitat Koyama M, Kaneko A, Ino T, Koike M, Kamata Y, Iijima R, Kamimuta Y, Takashima A, Suzuki M, Hongo C, Inumiya S, Takayanagi M, Nishiyama A (2002) Effects of nitrogen in HfSiON gate dielectric on the electrical and thermal characteristics. Tech Dig IEDM 849–852 Koyama M, Kaneko A, Ino T, Koike M, Kamata Y, Iijima R, Kamimuta Y, Takashima A, Suzuki M, Hongo C, Inumiya S, Takayanagi M, Nishiyama A (2002) Effects of nitrogen in HfSiON gate dielectric on the electrical and thermal characteristics. Tech Dig IEDM 849–852
27.
Zurück zum Zitat Wang H, Wang Y, Zhang J, Ye C, Wang HB, Feng J, Wang BY, Li Q, Jiang Y (2008) Interface control and leakage current conduction mechanism in HfO2 film prepared by pulsed laser deposition. Appl Phys Lett 93:202904CrossRefADS Wang H, Wang Y, Zhang J, Ye C, Wang HB, Feng J, Wang BY, Li Q, Jiang Y (2008) Interface control and leakage current conduction mechanism in HfO2 film prepared by pulsed laser deposition. Appl Phys Lett 93:202904CrossRefADS
28.
Zurück zum Zitat Puthenkovilakam R, Sawkar M, Chang JP (2005) Electrical characteristics of postdeposition annealed HfO2 on silicon. Appl Phys Lett 86:202902CrossRefADS Puthenkovilakam R, Sawkar M, Chang JP (2005) Electrical characteristics of postdeposition annealed HfO2 on silicon. Appl Phys Lett 86:202902CrossRefADS
29.
Zurück zum Zitat Zhao R, Li WW, Chen L, Meng QQ, Yang J, Wang H, Wang YQ, Tang RJ, Yang H (2012) Conduction mechanisms of epitaxial EuTiO3 thin films. Appl Phys Lett 101:102901CrossRefADS Zhao R, Li WW, Chen L, Meng QQ, Yang J, Wang H, Wang YQ, Tang RJ, Yang H (2012) Conduction mechanisms of epitaxial EuTiO3 thin films. Appl Phys Lett 101:102901CrossRefADS
30.
Zurück zum Zitat Seo Y, Lee S, An I, Song C, Jeong H (2009) Conduction mechanism of leakage current due to the traps in ZrO2 thin film, semiconductor science and technology. Semicond Sci Technol 24:115016CrossRefADS Seo Y, Lee S, An I, Song C, Jeong H (2009) Conduction mechanism of leakage current due to the traps in ZrO2 thin film, semiconductor science and technology. Semicond Sci Technol 24:115016CrossRefADS
31.
Zurück zum Zitat Pan RK, Zhang TJ, Wang JY, Wang JZ, Wang DF, Duan MG (2012) Mechanisms of current conduction in Pt/BaTiO3/Pt resistive switching cell. Thin Solid Films 520:4016–4020CrossRef Pan RK, Zhang TJ, Wang JY, Wang JZ, Wang DF, Duan MG (2012) Mechanisms of current conduction in Pt/BaTiO3/Pt resistive switching cell. Thin Solid Films 520:4016–4020CrossRef
32.
Zurück zum Zitat Sze SM (ed) (2007) Physics of semiconductor devices. Wiley, New York Sze SM (ed) (2007) Physics of semiconductor devices. Wiley, New York
33.
Zurück zum Zitat Maissel LI, Glang R (eds) (1970) Handbook of thin film technology. McGraw-Hill Inc., New York Maissel LI, Glang R (eds) (1970) Handbook of thin film technology. McGraw-Hill Inc., New York
34.
Zurück zum Zitat Liu W, Liu Z, Yan F, Tan T (2010) Influence of RF power on the structure and optical properties of sputtered hafnium dioxide thin films. Phys B 405:1108–1112CrossRefADS Liu W, Liu Z, Yan F, Tan T (2010) Influence of RF power on the structure and optical properties of sputtered hafnium dioxide thin films. Phys B 405:1108–1112CrossRefADS
35.
Zurück zum Zitat Hullavarad SS, Pugel DE, Jones EB, Vispute RD, Venkatesan T (2007) Low leakage current transport and high breakdown strength of pulsed laser deposited HfO2/SiC metal-insulator-semiconductor device structures. J Electron Mater 36:648–653CrossRefADS Hullavarad SS, Pugel DE, Jones EB, Vispute RD, Venkatesan T (2007) Low leakage current transport and high breakdown strength of pulsed laser deposited HfO2/SiC metal-insulator-semiconductor device structures. J Electron Mater 36:648–653CrossRefADS
36.
Zurück zum Zitat Lampert MA, Mark P (eds) (1970) Current injection in solids. Academic Press, New York Lampert MA, Mark P (eds) (1970) Current injection in solids. Academic Press, New York
37.
Metadaten
Titel
Current conduction mechanisms in HfO2 and SrHfON thin films prepared by magnetron sputtering
verfasst von
Li-ping Feng
Ning Li
Hao Tian
Zheng-tang Liu
Publikationsdatum
01.02.2014
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 4/2014
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-013-7876-6

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