Skip to main content

2011 | OriginalPaper | Buchkapitel

10. Data Analysis

verfasst von : Manjul Bhushan, Mark B. Ketchen

Erschienen in: Microelectronic Test Structures for CMOS Technology

Verlag: Springer New York

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

In CMOS technology, electrical measurements are carried out on a variety of test structure macros at each test stop as outlined in Fig. 1.3. The data collected from these measurements are analyzed and the information used for technology development, routine process monitoring, and product debug. The number of measured parameters from a single macro on one reticle field repeated across a wafer may be anywhere from less than ten to over a few hundreds. With hundreds of wafer starts per day, a large amount of data are collected even if measurements are made only on selected sites on a subset of wafers. Data are stored in a centralized database and software tools are made available for data manipulation and graphics.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Box GEP, Hunter WG, Hunter JS (1978) Statistics for experimenters: An introduction to design data analysis and model building. Wiley, New York, NYMATH Box GEP, Hunter WG, Hunter JS (1978) Statistics for experimenters: An introduction to design data analysis and model building. Wiley, New York, NYMATH
2.
Zurück zum Zitat Burr JT (2005) Elementary statistical quality control, 2nd edn. Marcel Dekker, New York, NY.MATH Burr JT (2005) Elementary statistical quality control, 2nd edn. Marcel Dekker, New York, NY.MATH
3.
Zurück zum Zitat Montgomery DC (2001) Design and analysis of experiments, 5th edn. Wiley, New York, NY Montgomery DC (2001) Design and analysis of experiments, 5th edn. Wiley, New York, NY
4.
Zurück zum Zitat Koronacki J, Thomson JR (2001) Statistical process control: the Deming paradigm and beyond, 2nd edn. Chapman and Hall, Boca Raton, FL Koronacki J, Thomson JR (2001) Statistical process control: the Deming paradigm and beyond, 2nd edn. Chapman and Hall, Boca Raton, FL
5.
Zurück zum Zitat Joglekar A (2001) Statistical methods for six sigma in R and D and manufacturing. Wiley Interscience, Hoboken, NJ Joglekar A (2001) Statistical methods for six sigma in R and D and manufacturing. Wiley Interscience, Hoboken, NJ
6.
Zurück zum Zitat Pande PS, Neuman RP, Cavanagh RR (2000) The six sigma way. McGraw-Hill, New York, NY Pande PS, Neuman RP, Cavanagh RR (2000) The six sigma way. McGraw-Hill, New York, NY
7.
Zurück zum Zitat Tufte E (1983) The visual display of quantitative information. Graphics, Cheshire Tufte E (1983) The visual display of quantitative information. Graphics, Cheshire
8.
Zurück zum Zitat Tufte E (1997) Visual explanations. Graphics, CheshireMATH Tufte E (1997) Visual explanations. Graphics, CheshireMATH
9.
Zurück zum Zitat Tufte E (1990) Envisioning information. Graphics, Cheshire Tufte E (1990) Envisioning information. Graphics, Cheshire
13.
Zurück zum Zitat Hannaman DJ, Sayah HR, Allen RA, Buehler MG, Yung M (1990) Fault chip defect characterization for wafer scale integration. Proceedings of the 1990 IEEE international conference on microelectronic test structures, 1990, pp 67–71 Hannaman DJ, Sayah HR, Allen RA, Buehler MG, Yung M (1990) Fault chip defect characterization for wafer scale integration. Proceedings of the 1990 IEEE international conference on microelectronic test structures, 1990, pp 67–71
14.
Zurück zum Zitat Montgomery DC (2009) Introduction to statistical quality control. Wiley, New York, NY Montgomery DC (2009) Introduction to statistical quality control. Wiley, New York, NY
15.
Zurück zum Zitat Ohkawa S, Aoki M, Masuda H (2004) Analysis and characterization of device variations in an LSI chip using an integrated device matrix array. IEEE Trans Semicond Manuf 17:155–165CrossRef Ohkawa S, Aoki M, Masuda H (2004) Analysis and characterization of device variations in an LSI chip using an integrated device matrix array. IEEE Trans Semicond Manuf 17:155–165CrossRef
16.
Zurück zum Zitat Maxwell P (2006) The design, implementation and analysis of test experiments. Proceedings IEEE international test conference, ITC’06, pp 1–9 Maxwell P (2006) The design, implementation and analysis of test experiments. Proceedings IEEE international test conference, ITC’06, pp 1–9
17.
Zurück zum Zitat Pang L-T, Qian K, Spanos CJ, Nikolic B (2009) Measurement and analysis of variability in 45 nm strained-Si CMOS technology. IEEE J Solid-State Circuits 44:2233–2243CrossRef Pang L-T, Qian K, Spanos CJ, Nikolic B (2009) Measurement and analysis of variability in 45 nm strained-Si CMOS technology. IEEE J Solid-State Circuits 44:2233–2243CrossRef
18.
Zurück zum Zitat May GS (2006) Fundamentals of semiconductor manufacturing and process control. Wiley, Hoboken, NJCrossRef May GS (2006) Fundamentals of semiconductor manufacturing and process control. Wiley, Hoboken, NJCrossRef
19.
Zurück zum Zitat Tyagi S, Auth C, Bai P, Curello G, Deshpande H, Gannavaram S et al (2005) An advanced low power, high performance, strained channel 65 nm technology. IEDM technical digest, pp 245–247 Tyagi S, Auth C, Bai P, Curello G, Deshpande H, Gannavaram S et al (2005) An advanced low power, high performance, strained channel 65 nm technology. IEDM technical digest, pp 245–247
20.
Zurück zum Zitat Gattiker A, Bhushan M, Ketchen MB (2006) Data analysis techniques for CMOS technology characterization and product impact assessment. Proceedings of the international test conference, ITC’06, pp 1–10 Gattiker A, Bhushan M, Ketchen MB (2006) Data analysis techniques for CMOS technology characterization and product impact assessment. Proceedings of the international test conference, ITC’06, pp 1–10
21.
Zurück zum Zitat Bhushan M, Gattiker A, Ketchen MB, Das KK (2006) Ring oscillators for CMOS process tuning and variability control. IEEE Trans Semicond Manuf 19:10–18CrossRef Bhushan M, Gattiker A, Ketchen MB, Das KK (2006) Ring oscillators for CMOS process tuning and variability control. IEEE Trans Semicond Manuf 19:10–18CrossRef
Metadaten
Titel
Data Analysis
verfasst von
Manjul Bhushan
Mark B. Ketchen
Copyright-Jahr
2011
Verlag
Springer New York
DOI
https://doi.org/10.1007/978-1-4419-9377-9_10

Neuer Inhalt