Skip to main content

21.02.2024

Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration

verfasst von: Huang Linsen

Erschienen in: Journal of Electronic Testing

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Weitere Produktempfehlungen anzeigen
Literatur
1.
Zurück zum Zitat Changzhong J, Pengbo W, Shiheng Z (2016) SLAM fatigue analysis of the vehicle door using ECS. Femfat. Proceedings SAE-China Congress & Exhibition Changzhong J, Pengbo W, Shiheng Z (2016) SLAM fatigue analysis of the vehicle door using ECS. Femfat. Proceedings SAE-China Congress & Exhibition
3.
Zurück zum Zitat Haiting Z, Guangye C (2003) Design of specification for accelerating test of electronic parts of vehicle. J Vib Shock 22(1):61–63 Haiting Z, Guangye C (2003) Design of specification for accelerating test of electronic parts of vehicle. J Vib Shock 22(1):61–63
4.
Zurück zum Zitat Han JG, Park NC, Hong WS (2009) CAF characteristics of FR-4 printed circuit board (PCB) for automotive electronics. SAE Int Han JG, Park NC, Hong WS (2009) CAF characteristics of FR-4 printed circuit board (PCB) for automotive electronics. SAE Int
5.
Zurück zum Zitat Jacob P (2015) Failure analysis and reliability on system level. Microelectron Reliab 55:2154–2158CrossRef Jacob P (2015) Failure analysis and reliability on system level. Microelectron Reliab 55:2154–2158CrossRef
6.
Zurück zum Zitat Jacob P (2016) Early life field failures in modern automotive electronics – an overview; root causes and precautions. Microelectron Reliab 64:79–83CrossRef Jacob P (2016) Early life field failures in modern automotive electronics – an overview; root causes and precautions. Microelectron Reliab 64:79–83CrossRef
7.
Zurück zum Zitat Khaldarov V et al (2022) Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications. Proceedings 2022 IEEE 72nd Electronic Components and Technology Conference Khaldarov V et al (2022) Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications. Proceedings 2022 IEEE 72nd Electronic Components and Technology Conference
8.
Zurück zum Zitat Khaldarov V et al (2023) New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference Khaldarov V et al (2023) New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference
9.
Zurück zum Zitat Kuczynska M et al (2017) The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. Microelectron Reliab 74:155–164CrossRef Kuczynska M et al (2017) The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. Microelectron Reliab 74:155–164CrossRef
10.
Zurück zum Zitat Kumar SM (2008) Analyzing random vibration fatigue. ANSYS Advant 2(3):39–42 Kumar SM (2008) Analyzing random vibration fatigue. ANSYS Advant 2(3):39–42
13.
Zurück zum Zitat Shao-tang H et al (2012) Environmental suitability and durability validation of automotive electronic and electric components. Environ Technol 28–32 Shao-tang H et al (2012) Environmental suitability and durability validation of automotive electronic and electric components. Environ Technol 28–32
14.
Zurück zum Zitat Smith DJ (2017) Reliability, maintainability and risk: practical methods for engineers. Elsevier Ltd, Kidlington, United Kingdom Smith DJ (2017) Reliability, maintainability and risk: practical methods for engineers. Elsevier Ltd, Kidlington, United Kingdom
15.
Zurück zum Zitat Steinberg DS (2000) Vibration analysis for Electronic Equipment. Wiley Steinberg DS (2000) Vibration analysis for Electronic Equipment. Wiley
16.
Zurück zum Zitat Tian K, Chunli L, Huabing J (2015) Adjustment method for random vibration test conditions in simulations of road transportation. Spacecraft Environ Eng Tian K, Chunli L, Huabing J (2015) Adjustment method for random vibration test conditions in simulations of road transportation. Spacecraft Environ Eng
17.
Zurück zum Zitat White KJ (1985) The road simulator–a practical laboratory approach. Proc Inst Mech Engrs White KJ (1985) The road simulator–a practical laboratory approach. Proc Inst Mech Engrs
18.
Zurück zum Zitat Wu M-L (2012) Assessing the impact of uncertainty in Physics-of-Failure analysis of microelectronics damage. Mater Sci Eng A 558:259–264CrossRef Wu M-L (2012) Assessing the impact of uncertainty in Physics-of-Failure analysis of microelectronics damage. Mater Sci Eng A 558:259–264CrossRef
19.
Zurück zum Zitat Xie D et al (2023) A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference Xie D et al (2023) A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference
Metadaten
Titel
Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration
verfasst von
Huang Linsen
Publikationsdatum
21.02.2024
Verlag
Springer US
Erschienen in
Journal of Electronic Testing
Print ISSN: 0923-8174
Elektronische ISSN: 1573-0727
DOI
https://doi.org/10.1007/s10836-024-06099-6

Neuer Inhalt