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Journal of Materials Science
Erschienen in: Journal of Materials Science 8/2018

02.11.2017 | Interface Behavior

Deformation response of grain boundary networks at high temperature

verfasst von: Laura Smith, Diana Farkas

Erschienen in: Journal of Materials Science | Ausgabe 8/2018

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Abstract

The deformation response of random grain boundary networks as a function of temperature and strain rate is explored using molecular dynamics atomistic simulations and an embedded atom method interatomic potential. We find that deformation at higher temperatures promotes both dislocation emission and grain boundary accommodation processes. The results allow estimating the activation energies and volumes for the deformation process. We find activation energy values for the deformation process similar to those for grain boundary diffusion and activation volumes consistent with an atomic shuffling mechanism. Our results suggest a picture of the deformation process as governed by the combination of the applied stress and thermally activated processes.
Vorheriger Artikel Uniaxial deformation of face-centered-cubic(Ni)-ordered B2(NiAl) bicrystals: atomistic mechanisms near a Kurdjumov–Sachs interface
Nächster Artikel Role of grain boundaries in determining strength and plastic deformation of yttria-stabilized tetragonal zirconia bicrystals

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Metadaten
Titel
Deformation response of grain boundary networks at high temperature
verfasst von
Laura Smith
Diana Farkas
Publikationsdatum
02.11.2017
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 8/2018
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-017-1760-8

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