Anzeige
Erschienen in:
2013 | OriginalPaper | Buchkapitel
Developing a Parametric Carbon Footprinting Tool: A Case Study of Wafer Fabrication in the Semiconductor Industry
verfasst von : Allen H. Hu, Ching-Yao Huang, Jessica Yin, Hsiao-Chun Wang, Ting-Hsin Wang
Erschienen in: Re-engineering Manufacturing for Sustainability
Verlag: Springer Singapore
Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
This study aims to establish a parametric-based tool capable of identifying key factors of the complicated manufacturing processes in the semiconductor industry to simplify the calculation of carbon footprint of products (CFP). Development of this methodology for wafer fabrication has been completed. An inventory of carbon emissions from a total of 7,114 samples was conducted, down to each step of process, including all 6-, 8-, and 12-in wafers with six different functions. Several regression models for CFP, which include key parameters, were developed. The results indicate that these regression models can effectively predict the CFP of the wafer fabrication.