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2017 | OriginalPaper | Buchkapitel

Developing Cemented Carbides Through ICME

verfasst von : Yong Du, Yingbiao Peng, Peng Zhou, Yafei Pan, Weibin Zhang, Cong Zhang, Kaiming Cheng, Kai Li, Han Li, Haixia Tian, Yue Qiu, Peng Deng, Na Li, Chong Chen, Yaru Wang, Yi Kong, Li Chen, Jianzhan Long, Wen Xie, Guanghua Wen, Shequan Wang, Zhongjian Zhang, Tao Xu

Erschienen in: Proceedings of the 4th World Congress on Integrated Computational Materials Engineering (ICME 2017)

Verlag: Springer International Publishing

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Abstract

The ICME (Integrated Computational Materials Engineering) for cemented carbides aims to combine key experiments with multi-scale simulations from nano (10−10~10−8 m) to micro (10−8~10−4 m) to meso (10−4~10−2 m) and to macro (10−2~10 m) during the whole R&D process of cemented carbides. Based on ICME, the framework for R&D of cemented carbides, involving end-user demand, product design and industrial application, is established. In this work, a description to our established thermodynamic and thermophysical (diffusion coefficient, interfacial energy, and thermal conductivity and so on) databases is presented, followed by simulation of microstructure evolution during sintering of cemented carbides by means of phase field method. Work is also done to investigate the correlation between microstructure and mechanical properties (crack, stress distribution, and coupled temp-displacement) by using phase field and finite element methods. The proposed ICME for cemented carbides is used to develop a few new cemented carbides (including double layer gradient cemented carbides and γ′-strengthened Co–Ni–Al binder cemented carbides), which have found industry applications.

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Metadaten
Titel
Developing Cemented Carbides Through ICME
verfasst von
Yong Du
Yingbiao Peng
Peng Zhou
Yafei Pan
Weibin Zhang
Cong Zhang
Kaiming Cheng
Kai Li
Han Li
Haixia Tian
Yue Qiu
Peng Deng
Na Li
Chong Chen
Yaru Wang
Yi Kong
Li Chen
Jianzhan Long
Wen Xie
Guanghua Wen
Shequan Wang
Zhongjian Zhang
Tao Xu
Copyright-Jahr
2017
DOI
https://doi.org/10.1007/978-3-319-57864-4_15

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