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2021 | OriginalPaper | Buchkapitel

8. Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging

verfasst von : Tadatomo Suga, Ran He, George Vakanas, Antonio La Manna

Erschienen in: 3D Microelectronic Packaging

Verlag: Springer Singapore

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Abstract

This chapter provides insight into direct Cu to Cu bonding and summarizes several critical empirical results. After comparing solder-less Cu–Cu bonding with solder-based bonding, we introduce various Cu–Cu stacking/bonding schemes for different 3D integration applications. We then review a number of methods of low-temperature Cu–Cu bonding including: (a) thermo-compression bonding (diffusion bonding), (b) Cu–Cu bonding with passivation capping layers, (c) surface-activated bonding (SAB) and (d) alternative bonding methods (e.g. Cu/dielectric hybrid bonding and Cu–Cu insertion bonding). The effects of surface activation, surface microstructures and characteristics, and surface passivation on Cu–Cu bonding are highlighted an– discussed to understand how bonding behavior depends on Cu surface cleanness, diffusion, temperature, compression pressure, and bonding atmosphere. Lastly, we briefly introduce the commercial equipment for Cu–Cu bonding for high-volume manufacturing and summarize with recommendations for future research directions.

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Vorheriges Kapitel Fundamentals and Failures in Die Preparation for 3D Packaging

Nächstes Kapitel Copper Micro and Nano Particles Mixture for 3D Interconnection Application

Process times targets depend on stacking process e.g. chip-on-chip (CoC), chip-on-wafer (CoW) or wafer-on-wafer (WoW) processes, equipment configuration and manufacturing embodiment and resulting throughput and Model of Record (MoR). For Cu–Cu process to be adopted in high-volume manufacturing (HVM), higher throughput and lower cost is required compared to established (and depreciated) solder-based processes.

Acquired by Tessera, now consolidated in Xperi and TiVo merger end of 2019.

Pre-tested and sorted chips, hence the nomenclature: “known good dies” (KGD’s)

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Titel: Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
verfasst von: Tadatomo Suga
Ran He
George Vakanas
Antonio La Manna
Verlag: Springer Singapore
Buch: 3D Microelectronic Packaging
Print ISBN: 978-981-15-7089-6

Electronic ISBN: 978-981-15-7090-2

Copyright-Jahr: 2021
DOI: https://doi.org/10.1007/978-981-15-7090-2_8

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