Anzeige
Erschienen in:
13.05.2020
Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 13/2020
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Abstract
Ag-decorated multi-walled carbon nanotubes (Ag-MWCNT) were investigated for use in Sn58Bi solder joints for FCLED packages. Among lead-free solders, Sn58Bi solder has been identified as a candidate for widespread use because of its low melting temperature and high tensile strength. However, Sn58Bi solder is brittle, and it is difficult to relieve it from an impact shock. To overcome these limitations, the bonding characteristics of Sn58Bi solder have been improved with Ag-MWCNT. Ag-MWCNT composite solder paste is fabricated by mixing Ag-MWCNTs of various concentrations with solder paste, and the FCLED chips are bonded on the printed circuit board. The thermal, electrical, and mechanical properties of the solder joints are investigated using various tests. The bonding strength of the Sn58Bi solder with the Ag-MWCNTs increased by 16% compared to that without it. Furthermore, the thermal resistance of the solder alloy decreased by a factor of 2 with the addition of 0.1 wt% Ag-MWCNT.