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Erschienen in: Journal of Materials Engineering and Performance 5/2019

29.04.2019

Effect of MgCl2 on the Corrosion Behavior of Copper Under Periodic Wet/Dry Cycle Condition

verfasst von: Chen Pan, Mingxiao Guo, Zhenyao Wang

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 5/2019

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Abstract

The corrosion behaviors of copper under periodic wet/dry cycle conditions were investigated. The characteristics of the corrosion product formed on copper were analyzed by x-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, and in situ electrochemical impedance spectroscopy. Weight loss results showed that the corrosion of copper under an MgCl2 deposition condition was more severe than that under NaCl. The main corrosion products formed on the tested sample under NaCl deposition condition consisted of Cu2Cl(OH)3 and Cu2O, while those under the MgCl2 deposition condition consisted of Cu2Cl(OH)3 and Mg2(OH)3Cl·4H2O. In the case of the NaCl deposition condition, a two-layered structure formed during the corrosion process. However, the corrosion product layer formed on copper under the MgCl2 deposition condition had an extremely loose structure. The effect of MgCl2 on the corrosion mechanism of copper is discussed.

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Metadaten
Titel
Effect of MgCl2 on the Corrosion Behavior of Copper Under Periodic Wet/Dry Cycle Condition
verfasst von
Chen Pan
Mingxiao Guo
Zhenyao Wang
Publikationsdatum
29.04.2019
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 5/2019
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-019-04058-3

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