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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 19/2020

12.08.2020

Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

verfasst von: Xianwei Zeng, Yichi Liu, Jiankang Zhang, Yi Liu, Xiaowu Hu, Xiongxin Jiang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 19/2020

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Abstract

The aim of the present study is to investigate the thermal behavior, microstructure and mechanical properties of high temperature Zn–30Sn–2Cu–xCe (x = 0, 0.05, 0.1, 0.5 wt%) Pb-free solders. The alloying of Ce refined the microstructure and increased the melting point of the solders. Zn–30Sn–2Cu–0.05Ce sample showed the best elongation, while the best ultimate tensile strength (UTS) and yield strength (YS) appeared in Zn–30Sn–2Cu–0.1Ce sample. The UTS of the alloys ranged from 44.02 to 64.95 MPa and the YS ranged from 32.73 to 51.83 MPa. Besides, the microhardness enhanced slightly with the addition of Ce. The analysis of the fractographies showed that the fracture mode turned from mixed brittle fracture into mixed ductile fracture with the addition of Ce.
Vorheriger Artikel Electrochemical reaction mechanism for Bi2Te3-based anode material in highly durable all solid-state lithium-ion batteries
Nächster Artikel Hydrothermal synthesis of Ba1−xLaxTiO3 (x = 0.2, 0.4, 0.6, & 0.8) nanorods: structure, morphology, optical band gap, and dielectricity behavior

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Metadaten
Titel
Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy
verfasst von
Xianwei Zeng
Yichi Liu
Jiankang Zhang
Yi Liu
Xiaowu Hu
Xiongxin Jiang
Publikationsdatum
12.08.2020
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 19/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04196-8

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