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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 17/2019

28.08.2019

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

verfasst von: Yuanming Chen, Yali Gao, Xiaofeng Jin, Xuan Zhou, Shouxu Wang, Wei He, Yan Hong, Guoyun Zhou, Weihua Zhang, Rui Sun, Yunzhong Huang, Yao Tang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 17/2019

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Abstract

Microstrip copper lines play an important role in high-speed printed circuit boards. It is necessary to perform appropriate surface finishing on the microstrip copper lines to avoid oxidation and reduce the loss of signal transmission. In this work, the microstrip copper lines after micro etching treatment were finished with immersion silver, immersion tin and electroless nickel immersion gold (ENIG), respectively. Surface microstructures, 3D features and surface contact angle were examined to find the effect of the copper finishing on signal transmission loss. The results indicated that the microstrip copper lines with micro-etching treatment exhibits low signal transmission loss as − 39.9 dB/m at 20 GHz. The tested microstrip copper lines showed that signal transmission loss follows an increasing trend successively with micro etching treatment, immersion silver treatment, immersion tin treatment and ENIG treatment.
Vorheriger Artikel Impact of gallium concentration in the gas phase on composition of InGaAsN alloys grown by AP-MOVPE correlated with their structural and optical properties
Nächster Artikel Inorganic metal iodide mediated solution phase surface passivation for quantum dot solar cell

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Metadaten
Titel
Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB
verfasst von
Yuanming Chen
Yali Gao
Xiaofeng Jin
Xuan Zhou
Shouxu Wang
Wei He
Yan Hong
Guoyun Zhou
Weihua Zhang
Rui Sun
Yunzhong Huang
Yao Tang
Publikationsdatum
28.08.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 17/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01991-w

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