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Erschienen in: Journal of Materials Science: Materials in Electronics 20/2018

06.09.2018

Effect of the addition of Sb and rare-earth elements La and Nd on the properties of Cu/6061Al with Zn–10Al–5Cu filler metals

verfasst von: Shuying Liu, Dongdong Zhang, Bowen Chu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 20/2018

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Abstract

The wetting ability, mechanical properties and microstructure distribution of a new solder based on a Zn–10Al–5Cu alloy with different amounts of Sb and rare earths added were studied. The results indicate that the spreading area of solder alloy decreases first and then increases and the shear strength of the Copper–aluminum joint increases with the increase of Sb element. The microstructure of the brazed weld matrix was refined. The Zn–10Al–5Cu–1.5Sb solder obtained by the test had better properties. Then, the rare earth (La and Nd) was added in Zn–10Al–5Cu–1.5Sb filler metal. It makes the wettability further improved. The wetting property of solder was the best with the 0.15 wt% RE addition. The large black eutectoid microstructure in the matrix become smaller and the number of IMC near the copper side increases with the addition of rare earth elements. The shear strength of brazed seam reaches the maximum when the content of rare earth element is 0.15%. Therefore, the optimum addition amount of the rare earth in Zn–10Al–5Cu–1.5Sb is about 0.15%.

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Literatur
1.
Zurück zum Zitat M. Zhang, S. Xue, W. Dai et al. Effect of Al content on properties of Zn-Al filler metal. Trans. China Weld. Inst. 31(9), 93–96 (2010) M. Zhang, S. Xue, W. Dai et al. Effect of Al content on properties of Zn-Al filler metal. Trans. China Weld. Inst. 31(9), 93–96 (2010)
2.
Zurück zum Zitat J. Huang, W. Long et al. Effect of the addition of Cu on the properties of Zn-85Al solder and Cu-Al solder joint. Trans. China Weld. Inst. 3, 58–59 (2011) J. Huang, W. Long et al. Effect of the addition of Cu on the properties of Zn-85Al solder and Cu-Al solder joint. Trans. China Weld. Inst. 3, 58–59 (2011)
3.
Zurück zum Zitat C.Z. Xia, Y.J. Li, U.A. Puchkov, S.A. Gerasimov, J. Wang, Crack analysis near vacuum brazing interface of Cu/Al dissimilar materials using Al-Si brazing alloy. Mater. Sci. Technol. 25(3), 383–387 (2009)CrossRef C.Z. Xia, Y.J. Li, U.A. Puchkov, S.A. Gerasimov, J. Wang, Crack analysis near vacuum brazing interface of Cu/Al dissimilar materials using Al-Si brazing alloy. Mater. Sci. Technol. 25(3), 383–387 (2009)CrossRef
4.
Zurück zum Zitat J. Yao, F.-D. Cui, S.-C. Li, Influence of addition of rare earth elements in Sn-9Zn-0.3Cu solder on brazed 6061 aluminum alloy joints. Trans. Mater. Hent Treat. 36(8), 62–65 (2015) J. Yao, F.-D. Cui, S.-C. Li, Influence of addition of rare earth elements in Sn-9Zn-0.3Cu solder on brazed 6061 aluminum alloy joints. Trans. Mater. Hent Treat. 36(8), 62–65 (2015)
5.
Zurück zum Zitat Y.L. Wang, K.K. Zhang, C.Y. Li et al. Effect of RE on properties of SnAgCu solder alloy and its joints. Trans. Mater. Heat Treat. 32(12), 34–37 (2011) Y.L. Wang, K.K. Zhang, C.Y. Li et al. Effect of RE on properties of SnAgCu solder alloy and its joints. Trans. Mater. Heat Treat. 32(12), 34–37 (2011)
6.
Zurück zum Zitat Z. Dongdong, L. Shuying, C. Ze, Z. Yiwen, Effect of element Sn and Cu on microstructure and mechanical properties of Zn-10Al solder. Welding 4, 21–24 (2017) Z. Dongdong, L. Shuying, C. Ze, Z. Yiwen, Effect of element Sn and Cu on microstructure and mechanical properties of Zn-10Al solder. Welding 4, 21–24 (2017)
7.
Zurück zum Zitat L. Zhang, J.-G. Han, H.E. Cheng-Wen et al. Effect of rare earth on microstructures and properties of lead-free solders. Chin. J. Nonferrous Met. 22(6), 1680–1696 (2012)CrossRef L. Zhang, J.-G. Han, H.E. Cheng-Wen et al. Effect of rare earth on microstructures and properties of lead-free solders. Chin. J. Nonferrous Met. 22(6), 1680–1696 (2012)CrossRef
8.
Zurück zum Zitat C.Z. Xia, Q.H. Liang, D.F. Chen, Investigation of microstructure and properties near the interface of copper/aluminum brazed joint. Kovove Mater. Met. Mater. 51(4), 235–239 (2013) C.Z. Xia, Q.H. Liang, D.F. Chen, Investigation of microstructure and properties near the interface of copper/aluminum brazed joint. Kovove Mater. Met. Mater. 51(4), 235–239 (2013)
9.
Zurück zum Zitat W. Dai, S.-B. Xue, J.-Y. Lou et al. Torch brazing 3003 aluminum alloy with Zn-Al filler metal. Trans. Nonferrous Met. Soc. China 22(2012), 30–35 (2011) W. Dai, S.-B. Xue, J.-Y. Lou et al. Torch brazing 3003 aluminum alloy with Zn-Al filler metal. Trans. Nonferrous Met. Soc. China 22(2012), 30–35 (2011)
10.
Zurück zum Zitat G.R. Zare, M. Divandari, H. Arabi, Investigation on interface of Al/Cu couples in compound casting. Mater. Sci. Technol. 29(2), 190–196 (2013)CrossRef G.R. Zare, M. Divandari, H. Arabi, Investigation on interface of Al/Cu couples in compound casting. Mater. Sci. Technol. 29(2), 190–196 (2013)CrossRef
11.
Zurück zum Zitat J. Feng, S.-B. Xue, Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn-22Al and Zn-22Al-0.05Ce filler metals. Mater. Des. 51, 907–915 (2013)CrossRef J. Feng, S.-B. Xue, Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn-22Al and Zn-22Al-0.05Ce filler metals. Mater. Des. 51, 907–915 (2013)CrossRef
12.
Zurück zum Zitat C.Z. Xia, Y.J. Li, J. Wang, H.J. Ma, Microstructure and phase constitution near interface of Cu/Al vacuum brazing. Mater. Sci. Technol. 23(7), 815–818 (2007)CrossRef C.Z. Xia, Y.J. Li, J. Wang, H.J. Ma, Microstructure and phase constitution near interface of Cu/Al vacuum brazing. Mater. Sci. Technol. 23(7), 815–818 (2007)CrossRef
13.
Zurück zum Zitat H. Wang, S.-B. Xue, W.X. Chen, J.X. Wang, Effects of addition of Ag, Al, Ga on the properties of Sn-9Zn lead-free solder. Trans. China Weld. Inst. 28(8), 33–36 (2007) H. Wang, S.-B. Xue, W.X. Chen, J.X. Wang, Effects of addition of Ag, Al, Ga on the properties of Sn-9Zn lead-free solder. Trans. China Weld. Inst. 28(8), 33–36 (2007)
14.
Zurück zum Zitat J.I. Feng, S.-B. Xue, J.-Y. Lou et al. Microstructure and properties of Cu/Al joints brazed with Zn-Al filler metals. Trans. Nonferrous Met. Soc. China 22(2012), 281–287 (2011) J.I. Feng, S.-B. Xue, J.-Y. Lou et al. Microstructure and properties of Cu/Al joints brazed with Zn-Al filler metals. Trans. Nonferrous Met. Soc. China 22(2012), 281–287 (2011)
15.
Zurück zum Zitat K. Shinozaki, K. Koyama, Developement of Al/Cu dissmilar brazing joint controlled form of intermetallic compound. Mater. Sci. Forum 36(1), 37–38 (2007) K. Shinozaki, K. Koyama, Developement of Al/Cu dissmilar brazing joint controlled form of intermetallic compound. Mater. Sci. Forum 36(1), 37–38 (2007)
Metadaten
Titel
Effect of the addition of Sb and rare-earth elements La and Nd on the properties of Cu/6061Al with Zn–10Al–5Cu filler metals
verfasst von
Shuying Liu
Dongdong Zhang
Bowen Chu
Publikationsdatum
06.09.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 20/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9647-2

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