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Erschienen in: Journal of Materials Science: Materials in Electronics 11/2019

24.04.2019

Effect of thickness on the electrical properties of PdCr strain sensitive thin film

verfasst von: Hao Liu, Xiling Mao, Jinting Cui, Shuwen Jiang, Xiaohui Zhao, Hongchuan Jiang, Wanli Zhang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 11/2019

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Abstract

The electrical properties of palladium chromium strain sensitive films with various thicknesses were fabricated onto sapphire substrates by direct current magnetron sputtering are investigated. The results show that the electrical properties of PdCr strain films are strongly dependent on their thickness. The square resistance and the temperature coefficient of resistance of PdCr strain sensitive films are dramatically decreased when the thickness of PdCr films that thinner than 232 nm, then the downward trend of electrical properties tends to be stabilized until 933 nm. The PdCr films with 933 nm thickness show a relative minimum temperature coefficient of resistance and excellent repeatability from room temperature to 800 °C. Furthermore, the stability of PdCr thin film strain gauges are measured at 600 and 800 °C by drift test, which reveals that the average resistance drift rate of PdCr strain film with 48 nm is almost ten times larger than that of the films with thickness of 933 nm. The above results further verify that the PdCr film with thickness of 933 nm possesses relatively superior electrical properties. Moreover, the strain response of PdCr thin film strain gauge with 933 nm on DZ22 Ni-based superalloys is studied, which indicates that the values of resistance are synchronous response to the strain implying the PdCr thin film strain gauge has a fast response to strain, and the gauge factor is 1.80, 1.88, 1.90 and 1.93 at 25, 400, 600 and 800 °C, respectively.

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Metadaten
Titel
Effect of thickness on the electrical properties of PdCr strain sensitive thin film
verfasst von
Hao Liu
Xiling Mao
Jinting Cui
Shuwen Jiang
Xiaohui Zhao
Hongchuan Jiang
Wanli Zhang
Publikationsdatum
24.04.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 11/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01390-1

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