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Erschienen in: The International Journal of Advanced Manufacturing Technology 7-8/2021

06.07.2021 | ORIGINAL ARTICLE

Effect of tool traverse speed on fabrication of open-cell copper foam using friction processing

verfasst von: Vyas Mani Sharma, Surjya Kanta Pal, Vikranth Racherla

Erschienen in: The International Journal of Advanced Manufacturing Technology | Ausgabe 7-8/2021

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Abstract

Large open-cell copper (Cu) foam plates were fabricated using the sintering and dissolution process with NaCl spacers. A rotating tungsten carbide (WC) tool with a flat shoulder was used to generate the temperature and pressure needed for sintering. Sintering was done on a friction stir welding machine. Tool path and die design control the sintered part shape and size. The process allows for fabrication of large three-dimensional metal foam parts on conventional milling and friction stir welding machines. NaCl volume fraction in metal powder-NaCl filler mixture was kept at 80%. Copper foam obtained in this manner had uniform porosity. Tool traverse speed affected sintering time and temperature and influenced the mechanical properties and microstructure of sintered parts. The microstructure of copper foam was studied using a scanning electron microscope. Compression tests were used to study its mechanical properties. Macro-pores were seen to have NaCl particle morphology. Foam mechanical properties were seen to be on par with that reported in literature. The sintering and dissolution process presented in this work results in open-cell foams with large surface areas. It is an attractive alternative for the fabrication of three-dimensional porous sintered parts.
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Metadaten
Titel
Effect of tool traverse speed on fabrication of open-cell copper foam using friction processing
verfasst von
Vyas Mani Sharma
Surjya Kanta Pal
Vikranth Racherla
Publikationsdatum
06.07.2021
Verlag
Springer London
Erschienen in
The International Journal of Advanced Manufacturing Technology / Ausgabe 7-8/2021
Print ISSN: 0268-3768
Elektronische ISSN: 1433-3015
DOI
https://doi.org/10.1007/s00170-021-07498-1

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