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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 7/2020

16.07.2020

Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy

verfasst von: Kangli Li, Jian Lin, Tongju Wang, Yongping Lei, Hanguang Fu

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 7/2020

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Abstract

In this paper, the effects of xGe (x = 0, 0.002, 0.005, 0.01%) on the melting point, spreadability, wettability, microstructure, and mechanical properties of Sn-32Pb-18Cd solder alloys were investigated. The experiment results showed that the addition of Ge could increase the spreading area and wetting properties. The microstructures of solder alloy after reflowing were mainly composed of Pb phase and β-Sn phases, and the Cd element was distributed in the matrix. The addition of Ge could enhance the tensile strength and ductility. When the Ge content was equal to 0.005%, the maximum elongation reached 53.70%.
Vorheriger Artikel Friction and Reciprocating Wear Behavior of Borided AISI H13 Steel Under Dry and Lubricated Conditions
Nächster Artikel Investigation of Crystallization and Mechanical Characteristics of Glass and Glass-Ceramic with the Compositions xFe2O3-35SiO2-35B2O3-10Al2O3-(20−x) Na2O

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Metadaten
Titel
Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy
verfasst von
Kangli Li
Jian Lin
Tongju Wang
Yongping Lei
Hanguang Fu
Publikationsdatum
16.07.2020
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 7/2020
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-020-04958-9

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