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Erschienen in:
A Hybrid MoM/UTD Method for the Analysis of a Monopole Antenna in an Aperture Kapitel lesen Erstes Kapitel lesen

2011 | OriginalPaper | Buchkapitel

17. Electromagnetic Partitioning Methodology Towards Multi-Physics Chip-Package-Board Co-Design and Co-Simulation

verfasst von : Sidina Wane, Damienne Bajon

Erschienen in: Electromagnetics and Network Theory and their Microwave Technology Applications

Verlag: Springer Berlin Heidelberg

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Abstract

This contribution discusses electromagnetic (EM) functional and topological (geometry) partitioning methodologies towards multi-physics Chip-Package-Board co-simulation and co-analysis. Although partitioning methodologies help containing EM analysis in manageable complexity, they bring fundamental challenges concerning the validity of cascade-based assumptions. Such challenges include proper incorporation in global analysis of couplings between constitutive sub-domains resulting from partitioning procedures. In the context of domain-decomposition approaches, importance of couplings between sub-partitions is illustrated through the concept of macro-pixel formulated using TWF (Transverse Waves Formulation) method. The formalization of partitioning strategies for better optimization of sub-partition interfacing borders or frontiers defined by the location of auxiliary sources introduced for the excitation of each partition brings the question of internal ports (local ground references) and their de-embedding.System-level mixed-signal power and signal integrity aware co-design and co-simulation requires combining EM analysis with high-speed digital switching activity and analog block transistor level description (or behavioral models). An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Limitations of classical segregated approaches based on cascading solutions from chip, package and board are investigated in reference to an integrated approach where chip, package and board are simulated with one single integrated approach. The segregated and the integrated approaches are assessed with real-world carrier design examples at component-level, function bloc-level as well as at system-level. Both full-wave and quasi-static solutions are obtained and compared. Finally, a multi-physics co-simulation approach combining EM and thermal simulations is discussed.

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Vorheriges Kapitel Novel Frequency-Domain and Time-Domain Techniques for the Combined Maxwell–Dirac Problem in the Characterization of Nanodevices
Nächstes Kapitel Parallel TLM Procedures for NVIDIA GPU
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Metadaten
Titel
Electromagnetic Partitioning Methodology Towards Multi-Physics Chip-Package-Board Co-Design and Co-Simulation
verfasst von
Sidina Wane
Damienne Bajon
Copyright-Jahr
2011
Verlag
Springer Berlin Heidelberg
Buch
Electromagnetics and Network Theory and their Microwave Technology Applications

Print ISBN: 978-3-642-18374-4

Electronic ISBN: 978-3-642-18375-1

Copyright-Jahr: 2011

DOI
https://doi.org/10.1007/978-3-642-18375-1_17

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