Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Published in:
Single/Double Precision Floating-Point Division and Square Root Unit Based on SRT-8 Algorithm Read chapter Read first chapter

2016 | OriginalPaper | Chapter

A High-Radix Switch Architecture Based on Silicon Photonic and 3D Integration

Authors : Jian Jie, Xiao Liquan, Lai Mingche, Xu Shi

Published in: Computer Engineering and Technology

Publisher: Springer Singapore

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The design of high-radix switch chips is becoming a challenging research field in EHPC (Exascale High-Performance Computing). Recent development of silicon photonic and 3D integration technologies has inspired new methods of designing high-radix switch chips. In this paper, we propose a high-radix switch architecture called Grahpein, which improves the radix and bandwidth while lowering switch chips power consumption by 3D integration and silicon photonic technology. The simulation result also shows that the average latencies under both random and hotspot patterns are less than 10 cycles, and the throughput under random pattern is more than 95%. Compared to hi-rise architecture, the proposed architecture ensures the packets from different source ports receive fairer service, thereby yielding more concentrated latency distribution. In addition, the power consumption of the Graphein chip is about 19.2 W, which totally satisfies the power constraint on a high-radix switch chip.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

inform now
previous chapter Accelerating Nyström Kernel Independent Component Analysis with Many Integrated Core Architecture
next chapter A Radiation Hardening Algorithm on 2nd Order CDR
Literature
1.
International Technology Roadmap for Semiconductors, ITRS
2.
SB7700: 36-port Non-blocking Managed EDR 100 Gb/s InfiniBand Switch, Mellanox Technologies (2015)
3.
OIF Next Generation Interconnect Framework, April 2013
4.
Birrittella, M.S., Debbage, M.: Intel@ Omni-Path Architecture: Enabling Scalable, High Performance Fabrics. IEEE (2015)
5.
Biberman, A., Bergman, K.: Optical interconnection networks for high-performance computing systems. IOP sci. Rep. Prog. Phys. 75, 046402 (2012). 15 pp
6.
Ophir, N., Mineo, C., Mountain, D., Bergman, K.: Silicon photonic microring links for high-bandwidth-density, low-power-chip I/O. In: IEEE MICRO, January 2013
7.
Koonath, P., Jalali, B.: Multilayer 3-d photonics in silicon. Opt. Express 15(20), 12686C12691 (2007)
8.
Morris Jr., R.W.: The three-dimensional stacked nanophotonic network-on-chip architecture with minimal reconfiguration. IEEE Trans. Comput. 63(1), 243–255 (2014)MathSciNetCrossRef
9.
Dang, D., Patra, B., Mahapatra, R., A 2-layer laser multiplexed photonic network-on-chip. In: 16th International Symposium on Quality Electronic Design (2015)
10.
Pavlidis, V., Friedman, E.: Three-dimensional Integrated Circuit Design. Morgan Kaufmann Pub, San Francisco (2009)
11.
Vangal, S., et al.: An 80-Tile 1.28 TFLOPS network-on-chip in 65 nm CMOS. In: IEEE International Solid State Circuits Conference, February 2007
12.
Bernstein, K., et al.: Interconnects in the third dimension: design challenges for 3D ICs. In: DAC (2007)
13.
Patti, R.S.: Three-dimensional integrated circuits and the future of system-on-chip design. In: Proceedings of IEEE, vol. 94, no. 6, June 2006
14.
Jeloka, S., Das, R.: Hi-Rise: a high-radix switch for 3D integration with single-cycle arbitration. In: MICRO (2014)
15.
Kim, J., Balfour, J., Dally, W.: Flattened butterfly topology for on-chip networks. In: MICRO (2007)
16.
Kim, J., Dally, W.J.: Technology-driven, highly-scalable dragonfly topology. In: ISCA (2008)
17.
Scott, S., Abts, D., Kim, J.: The black widow high-radix clos network. In: ISCA (2006)
18.
Binkert, N., Davis, Al.: The role of optics in future high radix switch design. In: ISCA (2011)
19.
Vantrease Corona, D., et al.: System implications of emerging nanophotonic technology. In: ISCA (2008)
20.
Pan Flexishare, Y., et al.: Channel sharing for an energy-efficient nanophotonic crossbar. In: HPCA (2010)
21.
Vantrease, D., et al.: Light speed arbitration and flow control for nanophotonic interconnects. In: MICRO (2009)
22.
Joshi, A., Batten, C., Kwon, Y.: Silicon-photonic clos networks for global on-chip communication. In: IEEE International Symposium on Network-on-Chip (NOCS), San Diego, CA (2009)
Metadata
Title
A High-Radix Switch Architecture Based on Silicon Photonic and 3D Integration
Authors
Jian Jie
Xiao Liquan
Lai Mingche
Xu Shi
Copyright Year
2016
Publisher
Springer Singapore
Book
Computer Engineering and Technology

Print ISBN: 978-981-10-3158-8

Electronic ISBN: 978-981-10-3159-5

Copyright Year: 2016

DOI
https://doi.org/10.1007/978-981-10-3159-5_17