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A study of DC and RF transconductance for different technologies of HEMT at low and high temperatures

  • 01-04-2023
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Abstract

The study delves into the effects of temperature on the transconductance of different HEMT technologies, including GaAs and GaN, at both low and high temperatures. It investigates six HEMT devices with varying gate lengths and widths, subjecting them to three distinct temperatures: −40°C, 25°C, and 150°C. The research focuses on DC and RF transconductance, highlighting significant differences in temperature impacts across device technologies and bias conditions. Notably, the study reveals that GaAs devices exhibit a temperature-insensitive behavior at a specific bias point, while GaN devices show a considerable drop in transconductance with increasing temperatures. The findings offer crucial insights for selecting appropriate device technologies and operating conditions for practical applications in microwave engineering.

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Title
A study of DC and RF transconductance for different technologies of HEMT at low and high temperatures
Authors
Mohammad Abdul Alim
Anwar Jarndal
Christophe Gaquiere
Giovanni Crupi
Publication date
01-04-2023
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2023
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-023-10176-5
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