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Published in: Journal of Materials Science: Materials in Electronics 4/2019

02-01-2019

Adhesion strength of plated Ni/Cu metallization in Si solar cells

Authors: Cheng Hsin Hsiao, Ji Yu Wu, Wen Jauh Chen

Published in: Journal of Materials Science: Materials in Electronics | Issue 4/2019

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Abstract

Replacing silver paste contacts in silicon solar cells by electroplated nickel and copper (Ni/Cu) connections offer potential advantages of more exceptional grid lines, lower series resistance, and reduced costs in industrial silicon solar cell manufacturing. To achieve acceptance in the market for an electroplated Ni/Cu contacts sufficient contact adhesion has become the significant issue. In this work, a thin nickel layer was deposited on textured (001) silicon by an electroless plating method and form silicides by annealing treatment—this substrate designed as Ax–Si. Afterward, the Cu(15µ m)/Ni(240–1440 nm)/Ax–Si were prepared by electroplating techniques. The structures of Cu/Ni/Ax–Si characterized by scanning electron microscopy, transmission electron microscope and powder X-ray diffraction. Peel force tests were conducted using a universal testing machine. The peel force tests performed at an angle of 90° with a constant speed of 30 mm/min. Excellent adhesion force with 5.2 N/mm achieved.

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Metadata
Title
Adhesion strength of plated Ni/Cu metallization in Si solar cells
Authors
Cheng Hsin Hsiao
Ji Yu Wu
Wen Jauh Chen
Publication date
02-01-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 4/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-00631-z

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