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Advancements in Metal Concentration Monitoring: Enhanced Copper and Nickel Measurement in Electrometallurgy Processes for Process Control

  • 2025
  • OriginalPaper
  • Chapter
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Abstract

This chapter explores the advancements in metal concentration monitoring, focusing on enhanced copper and nickel measurement in electrometallurgy processes. The text delves into the critical role of copper electrorefining (ER) and electrowinning (EW) in producing high-purity copper cathodes and recovering valuable byproducts. It discusses the challenges posed by soluble impurities, particularly nickel, and the limitations of traditional analytical methods. The chapter introduces optical spectroscopy as a viable alternative, highlighting its non-destructive nature and shorter result time. A significant focus is on the development of a new algorithm and hardware improvements for the Mipac Copper Monitor™, which enable accurate and rapid measurement of both copper and nickel concentrations. The text presents experimental validation of the new monitor, demonstrating its effectiveness in maintaining process stability and preventing safety incidents. It also discusses the potential for future investigations into the impact of other dissolved species in copper electrolytes, paving the way for monitoring other metal electrolytes. The chapter concludes with a comparison of the new monitor's accuracy against laboratory results, showcasing its reliability and potential for widespread adoption in the industry.

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Title
Advancements in Metal Concentration Monitoring: Enhanced Copper and Nickel Measurement in Electrometallurgy Processes for Process Control
Authors
Andrew Yang
Brane Pesic
Tony Mathison
Copyright Year
2025
DOI
https://doi.org/10.1007/978-3-032-00102-3_13
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