Issue 3/2013
Content (13 Articles)
Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming
Nadezhda Strusevich, Marc P. Y. Desmulliez, Eitan Abraham, David Flynn, Thomas Jones, Mayur Patel, Christopher Bailey
Local synthesis of carbon nanotubes for direct integration in Si microsystems – design considerations
Knut E. Aasmundtveit, Bao Quoc Ta, Quoc-Huy Nguyen, Tormod B. Haugen, Nils Hoivik, Einar Halvorsen
Wafer-level SLID bonding for MEMS encapsulation
H. Xu, T. Suni, V. Vuorinen, J. Li, H. Heikkinen, P. Monnoyer, M. Paulasto-Kröckel
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
Liang Xu, Di Jiang, Yi-Feng Fu, Stephane Xavier, Shailendra Bansropun, Afshin Ziaei, Shan-Tung Tu, Johan Liu
A novel approach for part family formation using K-means algorithm
Ashutosh Gupta, P. K. Jain, Dinesh Kumar
Phase precipitation and isothermal crystallization kinetics of FeZrB amorphous alloy
Bing-Ge Zhao, Ling-Hong Kong, Ting-Ting Song, Qi-Jie Zhai, Yu-Lai Gao
Simultaneous optimization of multiple performance characteristics in WEDM for machining ZC63/SiCp MMC
Thella Babu Rao, A. Gopala Krishna
Investigation on the application of reformed coke oven gas in direct reduction iron production with a mathematical model
Juan Wu, Shu-Qiang Guo, Wei-Zhong Ding
Bilateral teleoperation with reducing wave-based reflections
Min Zheng, Qing-Hai Chen, Wei Xiao, Hai-Nan Yang