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Published in: Journal of Electronic Materials 4/2021

15-01-2021 | Original Research Article

An Ecofriendly, Cost-Effective, Lightweight Microwave Absorber Based on Waste Toner

Authors: Hussein Habib, Yomen Atassi, Akil Salloum, Nassim Nasser Ali, Mojtaba Jafarian

Published in: Journal of Electronic Materials | Issue 4/2021

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Abstract

This work presents the design of an inexpensive environment-friendly and lightweight microwave absorber based on waste toner. MnNiZn ferrite/waste toner microwave absorbing composites were prepared, where waste toner serves both as host matrix and microwave absorber (active matrix). The structural characterization of the composite was investigated using x-ray diffractometry and FTIR spectroscopy. The magnetic characterization and microwave absorption characteristics in the S- and C-bands (2–8 GHz) were measured by a vibrating sample magnometer (VSM) and a vector network analyzer (VNA), respectively. The results showed a beneficial role of using waste toner in enhancing the microwave absorption performance of the composites in comparison with ferrite alone but in a passive matrix, such as paraffin. The optimized absorbers were obtained using 40 w% waste toner and of 60 w% MnNiZn ferrite. The absorber of the largest bandwidth of 4.55 GHz was obtained at a matching thickness of 6.0 mm and a minimum reflection loss (RL) of − 18 dB at the matching frequency of 5.05 GHz. The absorber of the same composition that shows the lowest minimum RL of − 22.5 dB has a matching thickness of 5.0 mm and a matching frequency of 6.31 GHz with a bandwidth of 3.5 GHz.

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Literature
1.
go back to reference Y. Duan and H. Guan, Microwave Absorbing Materials Book (Singapore: Pan Stanford, 2017). Y. Duan and H. Guan, Microwave Absorbing Materials Book (Singapore: Pan Stanford, 2017).
2.
go back to reference N.N. Ali, R.A. Marjeh, Y. Atassi, A. Salloum, A. Malki, and M. Jafarian, J. Magn. Magn. Mater. 453, 53 (2018).CrossRef N.N. Ali, R.A. Marjeh, Y. Atassi, A. Salloum, A. Malki, and M. Jafarian, J. Magn. Magn. Mater. 453, 53 (2018).CrossRef
4.
go back to reference C.L. Huang, C.W. Lou, C.F. Liu, C.H. Huang, X.M. Song, and J.H. Lin, Appl. Sci. 5, 1196 (2015).CrossRef C.L. Huang, C.W. Lou, C.F. Liu, C.H. Huang, X.M. Song, and J.H. Lin, Appl. Sci. 5, 1196 (2015).CrossRef
5.
go back to reference Z. Zhang, F. Zhang, X. Jiang, Y. Liu, Z. Guo, and J. Leng, Fibers Polym. 15, 2290 (2014).CrossRef Z. Zhang, F. Zhang, X. Jiang, Y. Liu, Z. Guo, and J. Leng, Fibers Polym. 15, 2290 (2014).CrossRef
6.
go back to reference S. Zhao, H. Zhao, G. Li, K. Dai, G. Zheng, C. Liu, and C. Shen, Mater. Lett. 129, 72 (2014).CrossRef S. Zhao, H. Zhao, G. Li, K. Dai, G. Zheng, C. Liu, and C. Shen, Mater. Lett. 129, 72 (2014).CrossRef
7.
go back to reference M. Wen, X. Sun, L. Su, J. Shen, J. Li, and S. Guo, Polymer 53, 1602 (2012).CrossRef M. Wen, X. Sun, L. Su, J. Shen, J. Li, and S. Guo, Polymer 53, 1602 (2012).CrossRef
8.
go back to reference L.D.C. Folguerasa, E.L. Noharab, R. Faezc, and M.C. Rezende, Materials Research 10, 95 (2007).CrossRef L.D.C. Folguerasa, E.L. Noharab, R. Faezc, and M.C. Rezende, Materials Research 10, 95 (2007).CrossRef
9.
go back to reference N.N. Ali, Y. Atassi, A. Salloum, A. Malki, M. Jafarian, and R.A. Marjeh, Mater. Sci.: Mater. Electron. 30, 6876 (2019). N.N. Ali, Y. Atassi, A. Salloum, A. Malki, M. Jafarian, and R.A. Marjeh, Mater. Sci.: Mater. Electron. 30, 6876 (2019).
12.
go back to reference V. Gaikwad, U. Kumar, F. Pahlevani, A. Piadasa, and V. Sahajwalla, ACS Sustain. Chem. 5, 11543 (2017).CrossRef V. Gaikwad, U. Kumar, F. Pahlevani, A. Piadasa, and V. Sahajwalla, ACS Sustain. Chem. 5, 11543 (2017).CrossRef
13.
go back to reference R.M. Cornell and U. Schwertmann, The Iron Oxides book, 2 (Hoboken: Wiley, 2003).CrossRef R.M. Cornell and U. Schwertmann, The Iron Oxides book, 2 (Hoboken: Wiley, 2003).CrossRef
14.
15.
go back to reference D. Yordanova, S. Angelova, and I. Dombalov, Int. Sci. 3, 1 (2014). D. Yordanova, S. Angelova, and I. Dombalov, Int. Sci. 3, 1 (2014).
16.
go back to reference A.A. Vučinića, D. Vujevića, K. Mujkićb, and M. Novakc, Chem. Eng. Trans. 34, 121 (2013). A.A. Vučinića, D. Vujevića, K. Mujkićb, and M. Novakc, Chem. Eng. Trans. 34, 121 (2013).
17.
go back to reference J. Ruan, L. Dong, J. Huang, Z. Huang, K. Huang, H. Dong, T. Zhang, and R. Qiu, JACS Sustain. Chem. Eng. 5, 4923 (2017).CrossRef J. Ruan, L. Dong, J. Huang, Z. Huang, K. Huang, H. Dong, T. Zhang, and R. Qiu, JACS Sustain. Chem. Eng. 5, 4923 (2017).CrossRef
18.
go back to reference Y. Li, J. Mao, H. Xie, and J. Li, Mater. Cycles Waste Manag. 20, 361 (2017).CrossRef Y. Li, J. Mao, H. Xie, and J. Li, Mater. Cycles Waste Manag. 20, 361 (2017).CrossRef
19.
20.
go back to reference L.P. Danescu, A. Morega, G. Telipan, and V. Stoic, Optoelectron. Adv. Mater. Rapid Commun. 4, 1182 (2010). L.P. Danescu, A. Morega, G. Telipan, and V. Stoic, Optoelectron. Adv. Mater. Rapid Commun. 4, 1182 (2010).
21.
go back to reference M.A. Notani, F.M. Nejad, A. Khodaii, and P. Hajikarimi, Road Mater Pavement Des. 0, 1 (2018). M.A. Notani, F.M. Nejad, A. Khodaii, and P. Hajikarimi, Road Mater Pavement Des. 0, 1 (2018).
22.
go back to reference H. Zhu, Y. Zhou, S. Wang, X. Wu, J. Hou, W. Yin, K. Feng, X. Wang, and J. Yang, RSC Adv. 49, 27654 (2018).CrossRef H. Zhu, Y. Zhou, S. Wang, X. Wu, J. Hou, W. Yin, K. Feng, X. Wang, and J. Yang, RSC Adv. 49, 27654 (2018).CrossRef
23.
go back to reference N. Mufti, T. Atma, A. Fuad, and E. Sutadji, AIP Conf. Proc. 1617, 165 (2014).CrossRef N. Mufti, T. Atma, A. Fuad, and E. Sutadji, AIP Conf. Proc. 1617, 165 (2014).CrossRef
24.
go back to reference S. Maroufi, M. Mayyas, R.K. Nekouei, M. Assefi, and V. Sahajwalla, ACS Sustain. Chem. Eng 6, 3765 (2018).CrossRef S. Maroufi, M. Mayyas, R.K. Nekouei, M. Assefi, and V. Sahajwalla, ACS Sustain. Chem. Eng 6, 3765 (2018).CrossRef
25.
26.
go back to reference F. Malek, E.M. Cheng, O. Nadiah, H. Nornikman, M. Ahmed, M.Z.A. Abdaziz, A.R. Osman, P.J. Soh, A.A.H. Azremi, A. Hasnain, and M.N. Taib, Prog. Electromagn. Res. 117, 449 (2011).CrossRef F. Malek, E.M. Cheng, O. Nadiah, H. Nornikman, M. Ahmed, M.Z.A. Abdaziz, A.R. Osman, P.J. Soh, A.A.H. Azremi, A. Hasnain, and M.N. Taib, Prog. Electromagn. Res. 117, 449 (2011).CrossRef
27.
go back to reference L. Dong, Z. Huang, J. Ruan, J. Zhu, J. Huang, M. Huang, S. Kong, and T. Zhang, ACS Sustain. Chem. Eng. 5, 10038 (2017).CrossRef L. Dong, Z. Huang, J. Ruan, J. Zhu, J. Huang, M. Huang, S. Kong, and T. Zhang, ACS Sustain. Chem. Eng. 5, 10038 (2017).CrossRef
Metadata
Title
An Ecofriendly, Cost-Effective, Lightweight Microwave Absorber Based on Waste Toner
Authors
Hussein Habib
Yomen Atassi
Akil Salloum
Nassim Nasser Ali
Mojtaba Jafarian
Publication date
15-01-2021
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 4/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-020-08679-6

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