An Example of Evaluation of Bonding Durability between Cemented Wood Chip Boards and Ceramic Tiles with Elastomer Adhesive

A new type of exterior wall panels have been developed for a prefabricated house system. These panels are produced by bonding ceramic tiles by use of chloroprene adhesive, butyl rubber sheet, and polyurethane adhesive on cemented wood chip boards fixed to light gauge steel frames in a factory. Such panels are less dangerous for falling off of tiles against deformation of panels due to flexibility of an adhesive layer, however, it seems that bonding durability against weathering or creep behavior must be checked. In order to evaluate bonding durability of the panels, various experimental approaches were performed such as an accelerated weathering test, an ozone resistance test, a boiling test, and a creep rupture test. Among these test, the creep rupture test which was conducted at various temperature and loading in both dry and wet condition was successful in obtaining quantitative information regarding with service life time of creep rupture of the bonded tiles. The data obtained were analyzed by means of the Larson-Miller method (F.R. Larson and J. Miller, Trans. ASME, Vol. 74, 765 (1952)), and finally master curves in both dry and wet condition could be obtained for the objected bonding system. It seems that the Larson-Miller method is useful for evaluating bonding durability of such elastomeric adhesive systems.