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Design and Application for Sealing of Strengthening Computer for Anti-hard Environment Read chapter Read first chapter

2019 | OriginalPaper | Chapter

An Inter-Layer-Distance Based Routing Algorithm for 3D Network-on-Chip

Authors : Tong Zou, Chengyi Zhang, Xuefeng Peng, Yuanxi Peng

Published in: Computer Engineering and Technology

Publisher: Springer Singapore

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Abstract

The three-dimensional Network-on-Chip (3D NoC) has been proposed to resolve the complex on-chip communication issues in multicore systems by using die stacking technology in recent years. It is more difficult to guarantee performance in 3D NoC system than 2D because of stacking dies and the unequal thermal conductance of different logic layers. To ensure the system performance and availability, we proposes an Inter-Layer-Distance based Routing (ILDR) algorithm, which distributes the traffic according to the inter-layer-distance from source node to destination node. We simultaneously consider the buffer status and node temperature of neighbors on path to determine the horizontal route of the next hop. The simulation results show that the proposed ILDR algorithm can apparently reduce network latency and improve network throughput in different experimental traffic patterns. Although the energy consumption is increased, the Energy delay product (EDP) is reduced, so ILDR is a power-efficient solution for 3D NoC.

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Metadata
Title
An Inter-Layer-Distance Based Routing Algorithm for 3D Network-on-Chip
Authors
Tong Zou
Chengyi Zhang
Xuefeng Peng
Yuanxi Peng
Copyright Year
2019
Publisher
Springer Singapore
Book
Computer Engineering and Technology

Print ISBN: 978-981-13-5918-7

Electronic ISBN: 978-981-13-5919-4

Copyright Year: 2019

DOI
https://doi.org/10.1007/978-981-13-5919-4_3