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2018 | OriginalPaper | Chapter

4. Application of Suresh and Lee Models in the Measurement of Residual Stress of Bulk Materials

Authors : Haidou Wang, Lina Zhu, Binshi Xu

Published in: Residual Stresses and Nanoindentation Testing of Films and Coatings

Publisher: Springer Singapore

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Abstract

Figure 4.1 shows the variation of pile-up height with indentation depth of the single crystal copper. The pile-up height of the single crystal copper shows a growth of approximate parabola with the increase of the indentation depth (from 300 to 800 nm), and the increase of amplitude is getting larger and larger. The pile-up heights change in the range of 45–95 nm, occupying the proportion of indentation depth about 12–15%.

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Metadata
Title
Application of Suresh and Lee Models in the Measurement of Residual Stress of Bulk Materials
Authors
Haidou Wang
Lina Zhu
Binshi Xu
Copyright Year
2018
Publisher
Springer Singapore
DOI
https://doi.org/10.1007/978-981-10-7841-5_4

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