Skip to main content
Top

ATZextra worldwide

2007 - 2022
Volumes
24
Issues
Chevron right icon
Special Issue 1/2022
Latest issue

Silicon wafers are turned into chips in four repeated processes. Lithography is the heart of the complex production process. And if you want to stay competitive, you have to get a handle on the reject rate.

The chip shortage has long burdened the car industry. In order to be better prepared for such crises in the future, ISF Munich provides the automotive industry with guidelines for an optimized semiconductor strategy. The six measures at a glance.

Cariad is reorganizing: Peter Bosch from Bentley becomes the new CEO, Dirk Hilgenberg has to go. The software subsidiary is to be linked even more closely to the Volkswagen Group brands.

PROMOTION

The 7th International ATZ Conference on Vehicle Acoustics will discuss the latest developments in acoustics management and NVH engineering. ATZlive invites you to Rueschlikon/Zurich (Switzerland) on July 11 and 12, 2023. Participation is also possible virtually via live stream. Register now!

About this journal

ATZextra worldwide provides technical innovations and detailed background reports on selected topics with in-depth analyses and in-depth expert commentary.

Metadata
Title
ATZextra worldwide
Coverage
Volume 12/2007 - Volume 27/2022
Publisher
Springer Fachmedien Wiesbaden
Electronic ISSN
2195-1489
Print ISSN
2195-1470
Journal ID
40111

Premium Partner