Texas Instruments has announced plans to build additional 300-mm semiconductor wafer factories in the United States. Construction of the first two of four possible “fabs” is scheduled to begin in 2022.
In 2022, Texas Instruments plans to begin construction of new factories in Sherman, Texas (USA), to produce 300-mm semiconductor wafers. The company says the North Texas site offers the potential for up to four “fabs.” Production at the first new fab is expected to begin as early as 2025. With up to four fabs, the total investment potential at the site could reach around 30 billion US-dollars, creating 3000 direct jobs over time.
The new fabs will complement TI’s existing 300-mm fabs. These include DMOS6 (Dallas, Texas), RFAB1 and the soon-to-be-completed RFAB2 (both in Richardson, Texas). These are expected to be ready for production in the second half of 2022. In addition, TI’s recently acquired LFAB (Lehi, Utah) fab is expected to be operational in early 2023. The company estimates that semiconductor growth in the electronics sector, especially in the industrial and automotive markets, will continue well into the future.