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Journal of Materials Science: Materials in Electronics

Published in:

05-08-2019

Average power handling capability on SiON thin film coplanar waveguide interconnections for MMICs

Authors: Tzu-Chun Tai, Hung-Wei Wu, Sin-Pei Wang, Cheng-Yuan Hung, Wei-Chen Tien, Yeong-Her Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 16/2019

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Abstract

In this study, we investigated the average power handling capability (APHC) of silicon-oxy-nitride (SiON) thin-film-coated coplanar waveguide (CPW) interconnections for monolithic microwave integrated circuits (MMICs). SiON thin films were prepared through very-high-frequency plasma-enhanced chemical vapor deposition at 40.68 MHz. Films prepared under various annealing conditions were studied. The microwave characteristics of CPW interconnections were analyzed for fitting to the International Technology Roadmap for Semiconductors. SiON thin films were annealed under a vacuum condition for 60 s at 700 °C, 900 °C and 1100 °C. The use of coated and annealed SiON thin films on the low-resistivity Si substrate effectively improved the substrate resistivity, reduced microwave attenuation at 1100 °C, and enhanced the APHC of CPW interconnections. These results indicate that the proposed method is suitable for application to MMICs.

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Title: Average power handling capability on SiON thin film coplanar waveguide interconnections for MMICs
Authors: Tzu-Chun Tai
Hung-Wei Wu
Sin-Pei Wang
Cheng-Yuan Hung
Wei-Chen Tien
Yeong-Her Wang
Publication date: 05-08-2019
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 16/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-019-01938-1

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