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01-01-2025 | Original Paper

Biphenyl-bridged thermoplastic polyesterimide films with good high-temperature dimensional stability and high-frequency dielectric properties for potential applications in two-layer flexible copper clad laminates: preparation and characterization

Authors: Shujun Han, Changxu Yang, Xiaolei Wang, Yuexin Qi, Duanyi Li, Jingang Liu

Published in: Journal of Polymer Research | Issue 1/2025

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Abstract

The article explores the development of biphenyl-bridged thermoplastic polyesterimide (PEsI) films designed for high-performance applications in two-layer flexible copper clad laminates (FCCLs). These films exhibit excellent thermal stability, high-frequency dielectric properties, and good adhesion with copper foil, making them suitable for advanced electronic devices. The research focuses on the synthesis and characterization of PEsI films using biphenyl-bridged dianhydrides and phenyl-substituted ester-containing diamines. The study highlights the balance between thermoplasticity, dimensional stability, and dielectric properties, essential for the reliability and performance of FCCLs in high-temperature and high-frequency environments.

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Metadata
Title
Biphenyl-bridged thermoplastic polyesterimide films with good high-temperature dimensional stability and high-frequency dielectric properties for potential applications in two-layer flexible copper clad laminates: preparation and characterization
Authors
Shujun Han
Changxu Yang
Xiaolei Wang
Yuexin Qi
Duanyi Li
Jingang Liu
Publication date
01-01-2025
Publisher
Springer Netherlands
Published in
Journal of Polymer Research / Issue 1/2025
Print ISSN: 1022-9760
Electronic ISSN: 1572-8935
DOI
https://doi.org/10.1007/s10965-024-04250-7

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