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Companies + Products

  • 01-12-2024
  • The Hansen Report
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Excerpt

The article delves into significant developments in the automotive and semiconductor industries. Hyundai Mobis and Zeiss are pioneering holographic windshield displays, set to transform vehicle surfaces with transparent in-plane displays. Alps Alpine Europe has appointed a new president to drive growth in automotive and industrial IoT solutions. Ardian's acquisition of Ion Beam Services bolsters the European semiconductor industry, while Sumitomo Electric Bordnetze opens a new plant for high-voltage electrical systems. Kyocera is constructing a plant for fine ceramic components, and Imec is launching an initiative on chiplets to enhance automotive manufacturing. Eberspächer introduces a compact semiconductor switch for autonomous vehicles, Vector unveils a modular test system for charging communication, and PCE Piezotronics offers pressure sensors for aeroacoustic measurements. Würth Elektronik introduces a ferrite ring for low-frequency suppression, and Infineon launches a high-voltage silicon carbide diode. TE Connectivity presents a flexible connection solution for electromobility. These innovations underscore the rapid advancements and strategic alliances shaping the future of the automotive and semiconductor sectors.

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Title
Companies + Products
Publication date
01-12-2024
Publisher
Springer Fachmedien Wiesbaden
Published in
ATZelectronics worldwide / Issue 12/2024
Electronic ISSN: 2524-8804
DOI
https://doi.org/10.1007/s38314-024-1958-x
    Image Credits
    AVL List GmbH/© AVL List GmbH, dSpace, BorgWarner, Smalley, FEV, Xometry Europe GmbH/© Xometry Europe GmbH, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, HORIBA/© HORIBA, Outokumpu/© Outokumpu, Gentex GmbH/© Gentex GmbH, Ansys, Yokogawa GmbH/© Yokogawa GmbH, Softing Automotive Electronics GmbH/© Softing Automotive Electronics GmbH, measX GmbH & Co. KG, Hirose Electric GmbH/© Hirose Electric GmbH