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ATZelectronics worldwide

Companies + Products

  • 01-12-2025
  • The Hansen Report
Published in:
Published in
ATZelectronics worldwide | Issue 12/2025

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Excerpt

The article delves into several key areas of innovation and collaboration in the automotive and semiconductor industries. Firstly, it highlights TDK's partnership with Porsche Motorsport for the Formula E and e-sports teams, focusing on electric vehicle technology and performance. Secondly, it discusses VI-grade's collaboration with TUC.technology to enhance driving simulator platforms with modular HMI systems. Additionally, the article covers leadership changes and strategic investments, such as Rosenberger's new CFO and GlobalFoundries' significant investment in Dresden for semiconductor production. It also explores software solutions like Komax's integration of DiIT's MES and Analog Devices' CodeFusion Studio 2.0 for AI-enabled embedded systems. Furthermore, it touches on Micron's high-bandwidth flash memory for automotive applications and Vector Informatik's interface for testing 3GPP LTE V2X communication. The article concludes with Infineon's launch of SiC power modules in EasyPACK C housing for electric vehicle charging systems, emphasizing higher power density and extended service life.
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Title
Companies + Products
Publication date
01-12-2025
Publisher
Springer Fachmedien Wiesbaden
Published in
ATZelectronics worldwide / Issue 12/2025
Electronic ISSN: 2524-8804
DOI
https://doi.org/10.1007/s38314-025-2085-z

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    AVL List GmbH/© AVL List GmbH, dSpace, BorgWarner, Smalley, FEV, Xometry Europe GmbH/© Xometry Europe GmbH, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, HORIBA/© HORIBA, Outokumpu/© Outokumpu, Gentex GmbH/© Gentex GmbH, Ansys, Yokogawa GmbH/© Yokogawa GmbH, Softing Automotive Electronics GmbH/© Softing Automotive Electronics GmbH, measX GmbH & Co. KG, Hirose Electric GmbH/© Hirose Electric GmbH